OMAP3525ECUSA
| Part Description |
ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 423-FCBGA (16x16) |
|---|---|
| Quantity | 203 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP3525 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C64x+, Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 423-FCBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 5A992C | Grade | Industrial | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 4 (72 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 423-LFBGA, FCBGA | RAM Controllers | LPDDR | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 600MHz | ||
| Supplier Device Package | 423-FCBGA (16×16) | USB | USB 1.x (3), USB 2.0 (1) | Voltage – I/O | 1.8V, 3.0V |
Overview of OMAP3525ECUSA – IC MPU OMAP-35XX 600MHZ 423FCBGA
The OMAP3525ECUSA is an ARM® Cortex®-A8 microprocessor IC delivering a single 32‑bit core at 600 MHz in a 423‑FCBGA (16×16) package. It is positioned for embedded systems and industrial applications that require on‑chip multimedia and signal processing capabilities alongside standard peripheral interfaces.
Designed by Texas Instruments, the device integrates dedicated co‑processors for signal processing and multimedia, memory and display controllers, multiple USB interfaces, and graphics acceleration, providing a compact solution for embedded designs operating across a wide temperature range.
Key Features
- Core ARM® Cortex®‑A8 single 32‑bit core running at 600 MHz for general application processing.
- Co‑processors Integrated signal processing and multimedia co‑processors (C64x+ and NEON™ SIMD) to accelerate DSP and multimedia workloads.
- Memory Controller On‑chip LPDDR memory controller support for system memory interfacing.
- Display LCD display interface controller and graphics acceleration to support embedded user interfaces.
- USB Connectivity Multiple USB interfaces including three USB 1.x ports and one USB 2.0 port for peripheral and host connectivity.
- Additional Interfaces HDQ/1‑Wire support for simple sensor and low‑pin count peripheral connections.
- Package and Mounting 423‑FCBGA (16×16) surface‑mount package, listed as 423‑LFBGA/FCBGA in supplier device package information.
- Industrial Grade Temperature Rated for operation from −40 °C to 105 °C, suitable for industrial embedded environments.
- RoHS Compliance Device is RoHS compliant for environmental and manufacturing requirements.
Typical Applications
- Industrial Control and Automation Use the Cortex‑A8 core and DSP co‑processors for control algorithms and signal processing in industrial embedded controllers operating across wide temperatures.
- Human‑Machine Interfaces (HMIs) LCD display controller and graphics acceleration enable responsive user interfaces for panel and machine displays.
- Multimedia Embedded Devices C64x+ and NEON™ SIMD co‑processors accelerate multimedia processing in compact embedded systems.
- Connectivity and Peripheral Integration Multiple USB ports and HDQ/1‑Wire support enable robust peripheral and sensor integration for instrumentation and communications equipment.
Unique Advantages
- Integrated Processing and Acceleration: Combination of a 600 MHz Cortex‑A8 core with C64x+ and NEON™ SIMD co‑processors reduces the need for separate DSP chips.
- Embedded Display Support: LCD controller and graphics acceleration simplify development of embedded HMIs without adding discrete graphics components.
- Flexible I/O Connectivity: Multiple USB interfaces plus HDQ/1‑Wire provide options for connecting a wide range of peripherals and sensors.
- Industrial Temperature Range: −40 °C to 105 °C rating supports deployments in harsh or temperature‑sensitive environments.
- Compact Surface‑Mount Package: 423‑FCBGA (16×16) package enables high‑density PCB designs for space‑constrained systems.
- Manufacturer Backing: Produced by Texas Instruments, the device is part of the OMAP3525 series with accompanying technical documentation.
Why Choose OMAP3525ECUSA?
The OMAP3525ECUSA combines a 600 MHz ARM® Cortex®‑A8 core with dedicated signal processing and multimedia co‑processors, integrated LPDDR memory support, display and USB interfaces, and graphics acceleration in a single 423‑FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for embedded designs that require a compact, integrated processor solution.
This device is well suited for engineers developing industrial HMIs, multimedia‑enabled embedded systems, and instrumentation where on‑chip acceleration, multiple interface options, and a rugged operating range are priorities. As part of Texas Instruments' OMAP3525 series, it provides a focused integration of processing and peripheral functions for streamlined system design.
Request a quote or submit an inquiry to get pricing and availability for the OMAP3525ECUSA.

Date Founded: 1930
Headquarters: Dallas, Texas, USA
Employees: 34,000+
Revenue: $17.52 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016