Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
PCI7611ZHKN/APCI7611ZHKTexas InstrumentsPCMCIA BUS CONTROLLER PBGA288ControllersN/AN/AN/A

N/A

1,153
PCI7612ZHKPCI7612ZHKTexas InstrumentsIC PC CARD CONTROLLER 216-BGAControllers216-BGA MICROSTAR (16x16)3V ~ 3.6V0°C ~ 70°C
Protocol:
PCI CardBus
Function:
Controller
Interface:
PCI
Standards:
IEEE 1394-1995, 1394a-2000, Firewireâ„¢, i.Linkâ„¢
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Package / Case:
216-LFBGA
Supplier Device Package:
216-BGA MICROSTAR (16×16)
701
PCI7621ZHKPCI7621ZHKTexas InstrumentsIC CONTROLLER PCI CARD 288LFBGAControllers288-NFBGA (16x16)3.3V, 5V–
Protocol:
PCI CardBus
Function:
Controller
Interface:
PCI
Standards:
IEEE 1394-1995, 1394a-2000, OHCI, Firewireâ„¢, i.Linkâ„¢
Voltage – Supply:
3.3V, 5V
Package / Case:
288-LFBGA
Supplier Device Package:
288-NFBGA (16×16)
27
PCI8402ZHKPCI8402ZHKTexas InstrumentsIC INTEGRATED FLASHMEDIA 216-BGAControllers216-BGA MICROSTAR (16x16)3V ~ 3.6V0°C ~ 70°C
Protocol:
PCI CardBus
Function:
Controller
Interface:
PCI
Standards:
IEEE 1394-1995, 1394a-2000, Firewireâ„¢, i.Linkâ„¢
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Package / Case:
216-LFBGA
Supplier Device Package:
216-BGA MICROSTAR (16×16)
367
PCI8412ZHKPCI8412ZHKTexas InstrumentsIC INTEGRATED FLASHMEDIA 216-BGAControllers216-BGA MICROSTAR (16x16)3V ~ 3.6V0°C ~ 70°C
Protocol:
PCI CardBus
Function:
Controller
Interface:
PCI
Standards:
IEEE 1394-1995, 1394a-2000, Firewireâ„¢, i.Linkâ„¢
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Package / Case:
216-LFBGA
Supplier Device Package:
216-BGA MICROSTAR (16×16)
1,393
PCI930PBKPCI930PBKTexas InstrumentsIC 3-1 ZOOM VIDEO SWITCH 128LQFPAnalog Switches, Multiplexers, Demultiplexers128-LQFP (14x14)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
128-LQFP
Supplier Device Package:
128-LQFP (14×14)
984
PCU9661B,118PCU9661B,118NXP SemiconductorsIC CONTROLLER 48LQFPControllers48-LQFP (7x7)3V ~ 3.6V-40°C ~ 85°C
Protocol:
I2C
Function:
Controller
Interface:
I2C
Standards:
IEEE 1149.1
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
15mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
48-LQFP
Supplier Device Package:
48-LQFP (7×7)
1,258
PCU9669B,118PCU9669B,118NXP SemiconductorsIC CONTROLLER 48LQFPControllers48-LQFP (7x7)3V ~ 3.6V-40°C ~ 85°C
Protocol:
I2C
Function:
Controller
Interface:
I2C
Standards:
IEEE 1149.1
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
15mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
48-LQFP
Supplier Device Package:
48-LQFP (7×7)
716
N/APCX7447AVGH1000NBMicrochip TechnologyIC MPU POWERPC 1.0GHZ 360CBGAMicroprocessors360-HiTCE-CBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Graphics Acceleration:
No
Voltage – I/O:
1.1V, 1.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA
Supplier Device Package:
360-HiTCE-CBGA (25×25)
Grade:
Industrial
871
N/APCX7447AVGH1167NBMicrochip TechnologyIC MPU POWERPC 1.167GHZ 360CBGAMicroprocessors360-HiTCE-CBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.167GHZ
Graphics Acceleration:
No
Voltage – I/O:
1.1V, 1.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA
Supplier Device Package:
360-HiTCE-CBGA (25×25)
Grade:
Industrial
1,028
N/APCX7457VGH1000NCMicrochip TechnologyIC MPU POWERPC G4 1.0GHZ 483CBGAMicroprocessors483-HiTCE-CBGA (29x29)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
483-BCBGA Exposed Pad
Supplier Device Package:
483-HiTCE-CBGA (29×29)
Grade:
Industrial
494
N/APCX7457VGU933NCMicrochip TechnologyIC MPU POWERPC G4 933MHZ 360CBGAMicroprocessors360-HiTCE-CBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
933MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA
Supplier Device Package:
360-HiTCE-CBGA (25×25)
Grade:
Industrial
1,335
N/APCX745BVZFU300LEMicrochip TechnologyIC MPU POWERPC 300MHZ 255BGAMicroprocessors255-PBGA (21x21)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
255-BBGA Exposed Pad
Supplier Device Package:
255-PBGA (21×21)
Grade:
Industrial
1,071
N/APCX755BVZFU300LEMicrochip TechnologyIC MPU POWERPC 300MHZ 360BGAMicroprocessors360-PBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA Exposed Pad
Supplier Device Package:
360-PBGA (25×25)
Grade:
Industrial
327
N/APCX755BVZFU350LEMicrochip TechnologyIC MPU 350MHZ 360BGAMicroprocessors360-PBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA Exposed Pad
Supplier Device Package:
360-PBGA (25×25)
Grade:
Industrial
1,181
N/APCX8240VTPU200EMicrochip TechnologyIC MPU 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
Grade:
Industrial
1,159
N/APCX8240VTPU200EZD3Microchip TechnologyIC MPU 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
Grade:
Industrial
346
N/APD39210C-022419-TRMicrochip TechnologyMCU FOR PD392XX FAMILYMicrocontrollersN/AN/AN/A

N/A

960
PEB22522FV2.1N/APEB22522FV2.1Infineon TechnologiesIC MULTI BIT RATE INTEGRATEDDrivers, Receivers, TransceiversN/AN/AN/A

N/A

51
PEB3342HTV2XN/APEB3342HTV2XIntelIC CODEC VOIP 100TQFPMicroprocessorsPG-TQFP-100N/AN/A
Graphics Acceleration:
No
578

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