 | N/A | PCI7611ZHK | Texas Instruments | PCMCIA BUS CONTROLLER PBGA288 | Controllers | N/A | N/A | N/A | N/A | 1,153 | |
 | | PCI7612ZHK | Texas Instruments | IC PC CARD CONTROLLER 216-BGA | Controllers | 216-BGA MICROSTAR (16x16) | 3V ~ 3.6V | 0°C ~ 70°C | Standards: IEEE 1394-1995, 1394a-2000, Firewire™, i.Link™ Voltage – Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C Supplier Device Package: 216-BGA MICROSTAR (16×16) | 701 | |
 | | PCI7621ZHK | Texas Instruments | IC CONTROLLER PCI CARD 288LFBGA | Controllers | 288-NFBGA (16x16) | 3.3V, 5V | – | Standards: IEEE 1394-1995, 1394a-2000, OHCI, Firewireâ„¢, i.Linkâ„¢ Voltage – Supply: 3.3V, 5V Supplier Device Package: 288-NFBGA (16×16) | 27 | |
 | | PCI8402ZHK | Texas Instruments | IC INTEGRATED FLASHMEDIA 216-BGA | Controllers | 216-BGA MICROSTAR (16x16) | 3V ~ 3.6V | 0°C ~ 70°C | Standards: IEEE 1394-1995, 1394a-2000, Firewire™, i.Link™ Voltage – Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C Supplier Device Package: 216-BGA MICROSTAR (16×16) | 367 | |
 | | PCI8412ZHK | Texas Instruments | IC INTEGRATED FLASHMEDIA 216-BGA | Controllers | 216-BGA MICROSTAR (16x16) | 3V ~ 3.6V | 0°C ~ 70°C | Standards: IEEE 1394-1995, 1394a-2000, Firewire™, i.Link™ Voltage – Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C Supplier Device Package: 216-BGA MICROSTAR (16×16) | 1,393 | |
 | | PCI930PBK | Texas Instruments | IC 3-1 ZOOM VIDEO SWITCH 128LQFP | Analog Switches, Multiplexers, Demultiplexers | 128-LQFP (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 128-LQFP (14×14) | 984 | |
 | | PCU9661B,118 | NXP Semiconductors | IC CONTROLLER 48LQFP | Controllers | 48-LQFP (7x7) | 3V ~ 3.6V | -40°C ~ 85°C | Voltage – Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Supplier Device Package: 48-LQFP (7×7) | 1,258 | |
 | | PCU9669B,118 | NXP Semiconductors | IC CONTROLLER 48LQFP | Controllers | 48-LQFP (7x7) | 3V ~ 3.6V | -40°C ~ 85°C | Voltage – Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Supplier Device Package: 48-LQFP (7×7) | 716 | |
| N/A | | PCX7447AVGH1000NB | Microchip Technology | IC MPU POWERPC 1.0GHZ 360CBGA | Microprocessors | 360-HiTCE-CBGA (25x25) | N/A | -40°C ~ 110°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.1V, 1.3V Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 360-HiTCE-CBGA (25×25) | 871 | |
| N/A | | PCX7447AVGH1167NB | Microchip Technology | IC MPU POWERPC 1.167GHZ 360CBGA | Microprocessors | 360-HiTCE-CBGA (25x25) | N/A | -40°C ~ 110°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.1V, 1.3V Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 360-HiTCE-CBGA (25×25) | 1,028 | |
| N/A | | PCX7457VGH1000NC | Microchip Technology | IC MPU POWERPC G4 1.0GHZ 483CBGA | Microprocessors | 483-HiTCE-CBGA (29x29) | N/A | -40°C ~ 110°C (TJ) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Package / Case: 483-BCBGA Exposed Pad Supplier Device Package: 483-HiTCE-CBGA (29×29) | 494 | |
| N/A | | PCX7457VGU933NC | Microchip Technology | IC MPU POWERPC G4 933MHZ 360CBGA | Microprocessors | 360-HiTCE-CBGA (25x25) | N/A | -40°C ~ 110°C (TJ) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.8V, 2.5V Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 360-HiTCE-CBGA (25×25) | 1,335 | |
| N/A | | PCX745BVZFU300LE | Microchip Technology | IC MPU POWERPC 300MHZ 255BGA | Microprocessors | 255-PBGA (21x21) | N/A | -40°C ~ 110°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Package / Case: 255-BBGA Exposed Pad Supplier Device Package: 255-PBGA (21×21) | 1,071 | |
| N/A | | PCX755BVZFU300LE | Microchip Technology | IC MPU POWERPC 300MHZ 360BGA | Microprocessors | 360-PBGA (25x25) | N/A | -40°C ~ 110°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Package / Case: 360-BBGA Exposed Pad Supplier Device Package: 360-PBGA (25×25) | 327 | |
| N/A | | PCX755BVZFU350LE | Microchip Technology | IC MPU 350MHZ 360BGA | Microprocessors | 360-PBGA (25x25) | N/A | -40°C ~ 110°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Package / Case: 360-BBGA Exposed Pad Supplier Device Package: 360-PBGA (25×25) | 1,181 | |
| N/A | | PCX8240VTPU200E | Microchip Technology | IC MPU 200MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 110°C (TJ) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 1,159 | |
| N/A | | PCX8240VTPU200EZD3 | Microchip Technology | IC MPU 200MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 110°C (TJ) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 110°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 346 | |
| N/A | | PD39210C-022419-TR | Microchip Technology | MCU FOR PD392XX FAMILY | Microcontrollers | N/A | N/A | N/A | N/A | 960 | |
 | N/A | PEB22522FV2.1 | Infineon Technologies | IC MULTI BIT RATE INTEGRATED | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 51 | |
 | N/A | PEB3342HTV2X | Intel | IC CODEC VOIP 100TQFP | Microprocessors | PG-TQFP-100 | N/A | N/A | | 578 | |