| N/A | | R9A07G074M05GBG#AC0 | Renesas | RZ/T2L MPU BGA196 NON-ETHERCAT S | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) Additional Interfaces: CANbus, DMA, GPIO, I2C, SCI, SPI, USB | 298 | |
| N/A | | R9A07G074M08GBG#AC0 | Renesas | RZ/T2L MPU BGA196 ETHERCAT SEC | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) Additional Interfaces: CANbus, DMA, GPIO, I2C, SCI, SPI, USB | 3 | |
| N/A | | R9A07G075M01GFA#AA0 | Renesas | IC MPU RZ 600/800MHZ 128LFQFP | Microprocessors | 128-LFQFP (14x20) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 128-LQFP Exposed Pad Supplier Device Package: 128-LFQFP (14×20) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,011 | |
| N/A | | R9A07G075M01GFP#AA0 | Renesas | IC MPU RZ 600/800MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LFQFP (24×24) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,398 | |
| N/A | | R9A07G075M05GFA#AA0 | Renesas | IC MPU RZ 600/800MHZ 128LFQFP | Microprocessors | 128-LFQFP (14x20) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 128-LQFP Exposed Pad Supplier Device Package: 128-LFQFP (14×20) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,472 | |
| N/A | | R9A07G075M05GFP#AA0 | Renesas | IC MPU RZ 600/800MHZ 176LFQFP | Microprocessors | 176-LFQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LFQFP (24×24) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 627 | |
| N/A | | R9A07G075M22GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,882 | |
| N/A | | R9A07G075M22GBG#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 320FBGA | Microprocessors | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 546 | |
| N/A | | R9A07G075M24GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 389 | |
 | | R9A07G075M24GBG#AC0 | Renesas | IC MPU 600MHZ/800MHZ 320LFBGA | Microprocessors | 320-LFBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 320-LFBGA (17×17) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,939 | |
| N/A | | R9A07G075M26GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 705 | |
| N/A | | R9A07G075M26GBG#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 320FBGA | Microprocessors | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 756 | |
| N/A | | R9A07G075M27GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 671 | |
| N/A | | R9A07G075M28GBA#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 945 | |
| N/A | | R9A07G075M28GBG#AC0 | Renesas | IC MPU RZ/T2M 600/800MHZ 320FBGA | Microprocessors | 320-FBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG Mounting Type: Surface Mount Supplier Device Package: 320-FBGA (17×17) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,221 | |
| N/A | | R9A07G084M04GBA#AC0 | Renesas | IC MPU RZ/N2L 300/400MHZ 121FBGA | Microprocessors | 121-FBGA (10x10) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 121-FBGA (10×10) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 126 | |
 | | R9A07G084M04GBG#AC0 | Renesas | IC MPU RZ/N2L 300/400MHZ 225FBGA | Microprocessors | 225-FBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 225-FBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 771 | |
| N/A | | R9A07G084M08GBA#AC0 | Renesas | IC MPU RZ/N2L 300/400MHZ 121FBGA | Microprocessors | 121-FBGA (10x10) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG Mounting Type: Surface Mount Supplier Device Package: 121-FBGA (10×10) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 313 | |
| N/A | | R9A07G084M08GBG#AC0 | Renesas | IC MPU RZ 300/400MHZ 225LFBGA | Microprocessors | 225-LFBGA (13x13) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG Mounting Type: Surface Mount Supplier Device Package: 225-LFBGA (13×13) Additional Interfaces: CANbus, I2C, SCI, SPI, WDT | 1,511 | |
 | | R9A08G045S11GBG#AC0 | Renesas | SOC RZ/G3S 13BGA NON-SECURE 1+1C | Microprocessors | 361-LFBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M33 RAM Controllers: DDR4, LPDDR4 Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-LFBGA (13×13) Additional Interfaces: DMA, I2C, I2S, MMC/SD/SDIO, SPI, UART | 1,799 | |