| N/A | | R9A07G054L14GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 445 | |
| N/A | | R9A07G054L14GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 132 | |
| N/A | | R9A07G054L17GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,205 | |
| N/A | | R9A07G054L17GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 675 | |
| N/A | | R9A07G054L18GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 27 | |
| N/A | | R9A07G054L18GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 378 | |
 | | R9A07G054L23GBG#AC0 | Renesas | IC MPU 200MHZ/1.2GHZ 456LFBGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 125 | |
| N/A | | R9A07G054L23GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 321 | |
 | N/A | R9A07G054L24GBG#AC0 | Renesas | IC MPU 200MHZ/1.2GHZ 551LFBGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,975 | |
| N/A | | R9A07G054L24GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,212 | |
| N/A | | R9A07G054L27GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 956 | |
| N/A | | R9A07G054L27GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 456BGA | Microprocessors | 456-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 456-LFBGA (15×15) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 407 | |
| N/A | | R9A07G054L28GBG#AC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 1,000 | |
| N/A | | R9A07G054L28GBG#BC0 | Renesas | IC MPU RZ 200MHZ/1.2GHZ 551BGA | Microprocessors | 551-LFBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Number of Cores/Bus Width: 3 Core, 64-Bit Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 551-LFBGA (21×21) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SPI, UART | 929 | |
 | | R9A07G063U01GBG#AC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-PBGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART | 598 | |
 | | R9A07G063U01GBG#BC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-PBGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART | 1,305 | |
 | | R9A07G063U02GBG#AC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-PBGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART | 717 | |
 | | R9A07G063U02GBG#BC0 | Renesas | IC MPU RZ/A3UL 1GHZ 361PBGA | Microprocessors | 361-PBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A55 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Display & Interface Controllers: LCD, MIPI/CSI2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 361-PBGA (13×13) Additional Interfaces: CANbus, eMMC/SD/SDIO, I2C, SCI, SPI, UART | 860 | |
| N/A | | R9A07G074M01GBG#AC0 | Renesas | RZ/T2L MPU BGA196 NON-ETHERCAT N | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) Additional Interfaces: CANbus, DMA, GPIO, I2C, SCI, SPI, USB | 694 | |
 | | R9A07G074M04GBG#AC0 | Renesas | RZ/T2L MPU BGA196 ETHERCAT NON-S | Microprocessors | 196-LFBGA (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-R52 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG Mounting Type: Surface Mount Supplier Device Package: 196-LFBGA (12×12) Additional Interfaces: CANbus, DMA, GPIO, I2C, SCI, SPI, USB | 207 | |