Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AGLP125V5-CSG289
AGLP125V5-CSG289Microchip TechnologyIC FPGA 212 I/O 289CSPFPGAs289-CSP (14x14)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of Logic Elements/Cells:
3120
Total RAM Bits:
36864
Number of I/O:
212
Number of Gates:
125000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
289-TFBGA, CSBGA
Supplier Device Package:
289-CSP (14×14)
1,056
AGLP125V5-CSG289I
AGLP125V5-CSG289IMicrochip TechnologyIC FPGA 212 I/O 289CSPFPGAs289-CSP (14x14)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells:
3120
Total RAM Bits:
36864
Number of I/O:
212
Number of Gates:
125000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
289-TFBGA, CSBGA
Supplier Device Package:
289-CSP (14×14)
621
N/A
AGXD466AAXD0CDAdvanced Micro DevicesIC MPU 333MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
333MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Additional Interfaces:
PCI
1,536
N/A
AGXD466AAXD0TDAdvanced Micro DevicesIC MPU 333MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
333MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Additional Interfaces:
PCI
903
N/A
AGXD500AAXE0CCAdvanced Micro DevicesIC MPU 366MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Additional Interfaces:
PCI
1,751
N/A
AGXD500AAXE0CDAdvanced Micro DevicesIC MPU 366MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Additional Interfaces:
PCI
686
N/A
AGXD500AAXE0TCAdvanced Micro DevicesIC MPU 366MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Additional Interfaces:
PCI
393
N/A
AGXD500AAXE0TDAdvanced Micro DevicesIC MPU 366MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Additional Interfaces:
PCI
1,130
N/A
AGXD500EEXE0BCAdvanced Micro DevicesIC MPU 366MHZ 396TEPBGAMicroprocessors396-TEPBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
396-BBGA
Supplier Device Package:
396-TEPBGA (35×35)
Additional Interfaces:
PCI
292
N/A
AGXD533EEXF0BCAdvanced Micro DevicesIC MPU 400MHZ 396TEPBGAMicroprocessors396-TEPBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
400MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
396-BBGA
Supplier Device Package:
396-TEPBGA (35×35)
Additional Interfaces:
PCI
563
N/A
ALVC1G66VSE-ERenesasIC UNI-LOGIC GATE BUFFER SMDAnalog Switches, Multiplexers, DemultiplexersN/AN/AN/A

N/A

478
N/A
ALVC1G66VSE-E-PRenesasIC ANALOG SWITCH 5-VSONAnalog Switches, Multiplexers, DemultiplexersN/AN/AN/A

N/A

161
AM1705BPTP3
AM1705BPTP3Texas InstrumentsIC MPU SITARA 375MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART
780
AM1705BPTP4
AM1705BPTP4Texas InstrumentsIC MPU SITARA 456MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART
171
AM1705BPTPA3
AM1705BPTPA3Texas InstrumentsIC MPU SITARA 375MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART
922
AM1705BPTPD4
AM1705BPTPD4Texas InstrumentsIC MPU SITARA 456MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART
501
AM1705CPTP3
AM1705CPTP3Texas InstrumentsIC MPU SITARA 375MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART
1,054
AM1705CPTP4
AM1705CPTP4Texas InstrumentsIC MPU SITARA 456MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART
370
AM1705CPTPA3
AM1705CPTPA3Texas InstrumentsIC MPU SITARA 375MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART
263
AM1705CPTPD4
AM1705CPTPD4Texas InstrumentsIC MPU SITARA 456MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART
445

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