AGLP125V5-CSG289

IC FPGA 212 I/O 289CSP
Part Description

IGLOO PLUS Field Programmable Gate Array (FPGA) IC 212 36864 3120 289-TFBGA, CSBGA

Quantity 1,387 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package289-CSP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case289-TFBGA, CSBGANumber of I/O212Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3120Number of Logic Elements/Cells3120
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGLP125V5-CSG289 – IGLOO PLUS Field Programmable Gate Array (FPGA), 212 I/O, 3,120 Logic Elements, 36,864-bit RAM, 289-TFBGA (CSBGA)

The AGLP125V5-CSG289 is an IGLOO PLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology offered in a 289-TFBGA (CSBGA) package. It provides a compact, commercial‑grade programmable logic option with 3,120 logic elements, 212 user I/Os and on‑chip RAM for implementing custom digital functions.

This device is targeted for commercial applications that require a moderate logic density and a high pin count in a surface‑mount BGA package, with a specified supply voltage window and an operating temperature range appropriate for commercial environments.

Key Features

  • Core Logic — 3,120 logic elements (LEs) enabling implementation of medium-complexity digital designs and custom logic functions.
  • Embedded Memory — 36,864 bits of on‑chip RAM (approximately 0.037 Mbits) for data buffering, state storage, and small lookup tables.
  • I/O Density — 212 user I/O pins to support multiple interfaces, parallel buses, and signal aggregation in compact designs.
  • Gate Count — Approximately 125,000 gates for mapping combinational and sequential logic.
  • Power Supply — Core voltage supply specified from 1.425 V to 1.575 V to match system power rails and ensure predictable operation within the defined range.
  • Package & Mounting — 289-TFBGA (CSBGA) package, supplier device package 289-CSP (14×14), designed for surface-mount PCB assembly.
  • Operating Range & Grade — Commercial grade with an operating temperature range from 0 °C to 85 °C.
  • Compliance — RoHS compliant to meet standard solderability and environmental requirements.

Typical Applications

  • Commercial Embedded Systems — Use the FPGA to implement custom control logic and I/O aggregation within commercial electronic products operating within a 0 °C to 85 °C range.
  • Interface Bridging and Protocol Handling — Leverage 212 I/Os and 3,120 logic elements to implement parallel interfaces, glue logic, and protocol conversion in space-constrained designs.
  • Prototyping and Evaluation — Deploy the device in development platforms where moderate logic capacity and high pin count are needed for functional prototyping and validation.

Unique Advantages

  • Balanced Logic Density: 3,120 logic elements provide a mid-range resource set suitable for medium-complexity designs without excessive board-level overhead.
  • High I/O Count: 212 user I/Os allow flexible interfacing to sensors, peripherals, and external controllers, reducing the need for additional interface chips.
  • Compact BGA Packaging: The 289-TFBGA (289-CSP 14×14) package delivers a small board footprint while supporting surface-mount assembly processes.
  • Predictable Supply Window: A defined core voltage range (1.425 V to 1.575 V) simplifies power-supply planning and integration with existing rails.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match typical commercial product environment requirements.
  • RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing and end‑product compliance.

Why Choose AGLP125V5-CSG289?

The AGLP125V5-CSG289 offers a well-rounded combination of logic resources, on‑chip memory and a high I/O count in a compact 289-TFBGA surface‑mount package, making it a strong choice for commercial embedded designs that need medium-density programmable logic and flexible interfacing. Its defined supply voltage range and commercial operating temperature make system-level integration and thermal planning straightforward.

This FPGA is suited to engineers and teams building commercial products requiring reliable, board-level programmable logic with RoHS compliance and a compact BGA footprint. Its specification set supports scalable designs where moderate logic capacity, abundant I/O, and on‑chip RAM enable consolidation of discrete logic and interface components.

Request a quote or submit a sales inquiry to check availability, pricing, and lead times for the AGLP125V5-CSG289. Our team can provide procurement details and support to help integrate this FPGA into your next commercial design.

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