APA075-FG144
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 100 27648 144-LBGA |
|---|---|
| Quantity | 680 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 100 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 75000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 27648 |
Overview of APA075-FG144 – ProASICPLUS FPGA, 100 I/O, 144-LBGA
The APA075-FG144 is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology. It provides a mid-range logic fabric with 3,072 logic elements (cells), approximately 75,000 gates and 27,648 bits of on-chip RAM for embedding control and buffering functions.
Designed for commercial-grade electronic designs, this surface-mount device offers 100 general-purpose I/O pins in a compact 144-LBGA package with a 2.3 V to 2.7 V supply and an operating temperature range of 0 °C to 70 °C.
Key Features
- Core / Logic 3,072 logic elements (cells) delivering approximately 75,000 gates suitable for mid-density logic integration and custom digital functions.
- Embedded Memory 27,648 bits of on-chip RAM (approximately 0.0276 Mbits) for local buffering, state storage and small data arrays.
- I/O Resources 100 I/O pins to support a variety of external interfaces and parallel or serial connectivity on a single device.
- Power Single-supply operation from 2.3 V to 2.7 V, enabling integration with low-voltage commercial logic domains.
- Package & Mounting Surface-mount 144-LBGA package (supplier package: 144-FPBGA, 13 × 13 mm) for compact board-level integration and high pin density.
- Operational Grade & Range Commercial grade with an ambient operating temperature of 0 °C to 70 °C, suited to general-purpose electronic products.
- Regulatory Status RoHS compliant for lead-free assembly and modern environmental requirements.
Typical Applications
- Embedded Control Systems — Mid-density logic and on-chip RAM make the device suitable for control logic, state machines and local processing in commercial embedded products.
- I/O-Intensive Interfaces — With 100 I/O pins, the FPGA can consolidate multiple parallel or serial interfaces and simplify board-level wiring.
- Glue Logic and System Integration — Provides customizable logic to implement protocol translation, timing adaptation and interface bridging between components.
- Prototyping and OEM Electronics — Compact LBGA footprint and commercial temperature rating suit OEM designs where board space and cost-effective integration are priorities.
Unique Advantages
- Balanced Logic Density: 3,072 logic elements and ~75,000 gates offer a practical balance between capability and cost for mid-range designs.
- On-Chip Memory: 27,648 bits of embedded RAM reduce dependence on external memory for small buffers and state storage, simplifying BOM and layout.
- High I/O Count: 100 I/Os allow consolidation of multiple signals and peripherals onto a single device, lowering system complexity.
- Compact Package: 144-LBGA (144-FPBGA, 13×13) saves PCB area while providing high pin density for sophisticated I/O routing.
- Low-Voltage Operation: 2.3 V to 2.7 V supply supports integration with modern low-voltage logic domains.
- RoHS Compliant: Meets environmental requirements for lead-free assembly and regulatory alignment.
Why Choose APA075-FG144?
The APA075-FG144 delivers a practical, commercial-grade FPGA solution for designs that require a mid-range mix of logic, on-chip memory and a substantial number of I/Os in a compact BGA package. Its combination of 3,072 logic elements, ~75,000 gates and 27,648 bits of embedded RAM provides designers with the resources needed to implement custom control, interface and glue logic without large external component counts.
This device is well suited to OEMs and engineers working on commercial embedded systems where board space, I/O count and integration matter. With RoHS compliance and a surface-mount 144-LBGA package, APA075-FG144 supports streamlined manufacturing and integration into modern product designs.
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