AGLP125V5-CSG281I

The AGLP125V5-CSG281I is an IGLOO PLUS Field Programmable Gate Array (FPGA) in a compact 281-TFBGA / CSBGA package intended for industrial applications. It integrates 3,120 logic elements, approximately 36,864 bits of on-chip RAM, and 212 I/O pins to support moderate-density custom logic, protocol bridging, and I/O consolidation in space-constrained systems.

Designed for surface-mount assembly and rated for an industrial temperature range of −40 °C to 100 °C, this device provides a balance of integration and environmental robustness for embedded and industrial designs that require a compact FPGA solution.

Key Features

• Core Logic 3,120 logic elements and approximately 125,000 gates provide resources for implementing custom digital functions and glue logic.
• On-Chip Memory Approximately 36,864 bits of embedded RAM to support buffering, small lookup tables, and local data storage.
• High I/O Count 212 available I/O pins enable extensive interfacing with peripherals, sensors, and external devices.
• Power Supply Core voltage supply range of 1.425 V to 1.575 V for defined operating conditions.
• Package and Mounting 281-TFBGA (supplier device package: 281-CSP, 10×10 mm) in a surface-mount form factor suitable for compact board layouts.
• Industrial Temperature Range Specified operating temperature from −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory Status RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Industrial Automation Implement control logic and protocol conversion where the industrial temperature rating and 212 I/Os support diverse field connections.
• Embedded System Glue Logic Use the 3,120 logic elements and on-chip RAM to consolidate discrete logic, bus interfacing, and peripheral adaptation in compact designs.
• Sensor Aggregation and Pre-processing Aggregate multiple sensor inputs with on-chip RAM for buffering and pre-processing before passing data to a host processor.
• Compact Board Designs The 281-CSP (10×10) package supports space-constrained applications requiring moderate programmable logic capacity.

Unique Advantages

• Moderate Logic Density: 3,120 logic elements and ~125,000 gates enable implementation of substantial custom logic without excess device complexity.
• Ample I/O Accessibility: 212 I/Os provide flexibility for interfacing with a wide range of peripherals and external devices, reducing the need for additional I/O expanders.
• Compact, Surface-Mount Package: The 281-TFBGA / 281-CSP (10×10) footprint helps minimize PCB area while maintaining solderable surface-mount compatibility.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C for deployment in industrial environments that demand wider operating ranges.
• On-Board Memory: Approximately 36,864 bits of embedded RAM for local buffering and small data structures, simplifying external memory requirements.
• RoHS Compliant: Supports environmental compliance goals in manufacturing and product lifecycle planning.

Why Choose AGLP125V5-CSG281I?

The AGLP125V5-CSG281I positions itself as a compact, industrial-grade FPGA option offering a practical balance of logic capacity, on-chip memory, and extensive I/O in a small surface-mount package. Its defined core voltage range and industrial operating temperature make it suitable for embedded and industrial designs that require dependable programmable logic without excessive footprint or complexity.

This device is well suited to design teams implementing control logic, protocol bridging, and I/O aggregation in constrained form factors, delivering long-term value through a focused set of resources and compliance for standard manufacturing processes.

Request a quote or submit a sales inquiry today to discuss availability, pricing, and how the AGLP125V5-CSG281I can fit your next embedded or industrial design.