AGLP125V5-CS281I

IC FPGA 212 I/O 281CSP
Part Description

IGLOO PLUS Field Programmable Gate Array (FPGA) IC 212 36864 3120 281-TFBGA, CSBGA

Quantity 707 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package281-CSP (10x10)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case281-TFBGA, CSBGANumber of I/O212Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3120Number of Logic Elements/Cells3120
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of AGLP125V5-CS281I – IGLOO PLUS Field Programmable Gate Array (FPGA) IC 212 I/O, 36,864-bit RAM, 3,120 Logic Elements, 281-TFBGA

The AGLP125V5-CS281I is an IGLOO PLUS field programmable gate array (FPGA) from Microchip Technology, delivered in a compact 281-TFBGA (CSBGA) package. It provides a programmable logic resource with 3,120 logic elements, approximately 36,864 bits of embedded RAM and a 212-pin I/O count for moderate-density designs.

Designed for industrial-grade deployments, this surface-mount FPGA supports a core supply range of 1.425 V to 1.575 V and an operating temperature range of -40 °C to 100 °C, enabling use in environments requiring extended temperature performance while maintaining RoHS compliance.

Key Features

  • Logic Capacity 3,120 logic elements (3120 logic elements) suitable for mid-range programmable logic implementations.
  • Embedded Memory Approximately 36,864 bits of on-chip RAM for buffering, state storage and small memory blocks.
  • I/O and Gate Count 212 user I/Os and 125,000 gates to support a variety of peripheral interfaces and logic functions.
  • Power Core voltage supply range of 1.425 V to 1.575 V to match system power domains.
  • Package and Mounting 281-TFBGA (CSBGA) package; supplier device package listed as 281-CSP (10×10). Surface-mount mounting type for standard PCB assembly.
  • Temperature and Grade Industrial grade with an operating temperature range from -40 °C to 100 °C.
  • Environmental Compliance RoHS compliant to meet common environmental requirements.

Unique Advantages

  • Balanced logic and memory resources: Combines 3,120 logic elements with 36,864 bits of embedded RAM to support control, glue logic and small data buffering within a single device.
  • High I/O count: 212 I/Os provide flexibility for interfacing multiple peripherals, sensors or external FPGAs without immediate need for additional I/O expanders.
  • Industrial temperature capability: Rated from -40 °C to 100 °C for deployment in harsh or temperature-variable environments.
  • Compact BGA footprint: 281-TFBGA package (281-CSP 10×10 supplier listing) enables high-density PCB layouts while supporting surface-mount assembly.
  • Controlled core voltage: Narrow supply range (1.425 V–1.575 V) simplifies power sequencing and domain planning for the FPGA core.
  • RoHS compliance: Meets lead-free requirements for environmentally regulated products and assemblies.

Why Choose AGLP125V5-CS281I?

The AGLP125V5-CS281I delivers a concise blend of logic capacity, embedded memory and a high I/O count in a compact surface-mount BGA package tailored for industrial applications. Its defined core voltage range and wide operating temperature window make it suitable for designs that require stable, medium-density programmable logic with environmental robustness.

This device is well suited to engineers and procurement teams seeking a programmable solution that balances integration and board-density considerations while remaining RoHS compliant. Its specification set supports scalable designs where moderate gate count, ample I/O, and on-chip RAM are required.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the AGLP125V5-CS281I.

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