AGLP125V2-CSG281I

The AGLP125V2-CSG281I is a Microchip Technology IGLOO PLUS Field Programmable Gate Array (FPGA) offered in a 281-TFBGA/CSBGA package. It provides 3,120 logic elements (LEs) with approximately 0.037 Mbits (36,864 bits) of on-chip RAM and an internal gate equivalence of 125,000 gates, making it suitable for compact, logic-dense embedded designs.

Designed for industrial-grade applications, the device supports up to 212 I/O pins, operates from a core supply range of 1.14 V to 1.575 V, and is specified for an operating temperature range of -40 °C to 100 °C. The part is RoHS compliant and supplied in a surface-mount package format.

Key Features

• Core Logic  Provides 3,120 logic elements and an internal equivalence of 125,000 gates to implement custom digital functions and control logic.
• Embedded Memory  Approximately 0.037 Mbits (36,864 bits) of on-chip RAM for small buffers, state machines, and local storage.
• I/O Capacity  Up to 212 I/O pins to support multiple peripherals, sensor interfaces, and external device connectivity.
• Power and Supply  Operates with a core voltage range from 1.14 V to 1.575 V to match target system power rails and designs.
• Package & Mounting  Available in a 281-TFBGA, CSBGA package; supplier device package listed as 281-CSP (10×10). Surface-mount mounting type supports standard PCB assembly flows.
• Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C for demanding environmental conditions.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use the FPGA for control logic, I/O aggregation, and deterministic timing in factory automation and process-control equipment, leveraging industrial grade temperature ratings and wide I/O count.
• Sensor and Signal Aggregation  Implement sensor interfacing, signal conditioning logic, and protocol bridging with available logic elements and 212 I/O pins for multiple input sources.
• Embedded System Glue Logic  Replace or consolidate discrete glue logic and small CPLDs by using the device’s logic capacity and on-chip RAM to streamline board designs.

Unique Advantages

• Compact logic capacity: 3,120 logic elements and 125,000 gate equivalence provide meaningful integration for mid-range FPGA tasks without large form factors.
• Significant I/O availability: Up to 212 I/Os enable direct connection to numerous peripherals and interfaces, reducing the need for additional I/O expanders.
• Industrial temperature range: -40 °C to 100 °C rating supports deployment in thermally demanding environments common in industrial applications.
• Surface-mount packaging: 281-TFBGA/CSBGA and 281-CSP (10×10) options support high-density PCB layouts and standard SMT assembly.
• RoHS compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose AGLP125V2-CSG281I?

The AGLP125V2-CSG281I is positioned for designs that require a balance of logic density, on-chip memory, and substantial I/O capacity in an industrial-grade, surface-mount form factor. Its defined core voltage range and extended operating temperature make it suitable for embedded and industrial applications that demand reliable operation across varied environments.

Engineers selecting this device benefit from a concentrated set of resources—logic elements, embedded RAM, and I/O—allowing consolidation of discrete components and simplified board-level integration while maintaining RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability details for the AGLP125V2-CSG281I and to discuss how it can fit into your next design.