AGLP125V2-CS289

The AGLP125V2-CS289 is an IGLOO PLUS Field Programmable Gate Array (FPGA) IC designed for commercial-grade embedded logic applications. It combines 3,120 logic elements, 36,864 bits of on‑chip RAM, and 212 user I/O in a compact 289‑TFBGA (CSBGA) surface-mount package.

With a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, this device is suited for systems that require moderate logic density, on-chip memory, and a high I/O count in a small footprint.

Key Features

• Core Logic 3,120 logic elements provide programmable resources for combinational and sequential logic implementations.
• Embedded Memory 36,864 bits of on‑chip RAM (approximately 0.037 Mbits) for data buffering, FIFOs, and small lookup tables.
• I/O Density 212 user I/O pins support a wide range of external interfaces and parallel connectivity requirements.
• Gate Count Approximately 125,000 equivalent gates for system-level glue logic and moderate integration of peripherals.
• Power Flexible core supply range from 1.14 V to 1.575 V to match system power rails and design constraints.
• Package & Mounting 289‑TFBGA (CSBGA) supplier device package (289‑CSP, 14×14) in a surface‑mount form factor for compact PCB designs.
• Operating Range & Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Embedded Control — Use the FPGA’s 3,120 logic elements and on‑chip RAM for control logic, protocol handling, and sensor interfacing within commercial electronic products.
• I/O Expansion and Interface Bridging — 212 user I/O enable dense parallel connectivity and interface translation between system components.
• Data Buffering and Small Memory Functions — On‑chip RAM supports buffering, temporary storage, and FIFO implementations for data flow management.
• Compact, High‑Density Board Designs — The 289‑TFBGA surface‑mount package is suited to space-constrained PCBs where high I/O and logic density are required.

Unique Advantages

• Balanced Logic and Memory — A combination of 3,120 logic elements and 36,864 bits of embedded RAM enables compact implementations of moderately complex logic with local data storage.
• High I/O Count in a Small Package — 212 user I/O in a 289‑TFBGA footprint reduces the need for external I/O expander components and simplifies board routing.
• Flexible Power Integration — Core voltage range (1.14 V–1.575 V) allows integration into designs with varied power architectures.
• Commercial‑Grade Reliability — Specified for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic applications.
• Surface‑Mount Package for Modern Assembly — 289‑TFBGA (289‑CSP, 14×14) packaging supports automated SMT assembly for volume production.
• RoHS Compliant — Conforms to common environmental directive requirements for material restrictions.

Why Choose AGLP125V2-CS289?

The AGLP125V2-CS289 delivers a practical balance of programmable logic, on‑chip memory, and a high-density I/O complement in a compact surface‑mount package. It is positioned for designers who need moderate logic capacity and local RAM within commercial-temperature systems where PCB space and I/O count are important considerations.

Its combination of 3,120 logic elements, 36,864 bits of embedded memory, 212 I/O, and a 289‑TFBGA package provides a scalable, robust building block for embedded control, interface consolidation, and compact system designs backed by RoHS compliance.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the AGLP125V2-CS289. Our team can provide assistance with lead times and volume requirements.