AGLP125V2-CS281I
| Part Description |
IGLOO PLUS Field Programmable Gate Array (FPGA) IC 212 36864 3120 281-TFBGA, CSBGA |
|---|---|
| Quantity | 388 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 281-CSP (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 281-TFBGA, CSBGA | Number of I/O | 212 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3120 | Number of Logic Elements/Cells | 3120 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of AGLP125V2-CS281I – IGLOO PLUS FPGA, 212 I/O, 3120 logic elements
The AGLP125V2-CS281I is an IGLOO PLUS field programmable gate array (FPGA) IC from Microchip Technology. It provides 3,120 logic elements, approximately 36,864 bits of on-chip RAM and up to 212 user I/Os in a compact 281-TFBGA / CSBGA package.
Designed for industrial-grade applications, this surface-mount FPGA supports a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, offering a balance of integration, moderate logic capacity and environmental robustness for embedded designs requiring numerous I/O and moderate embedded memory.
Key Features
- Core Logic — 3,120 logic elements (LEs) providing programmable logic capacity suitable for mid-range FPGA tasks.
- Gate Count — 125,000 gates for mapping combinational and sequential logic.
- Embedded Memory — 36,864 bits of on-chip RAM to support buffers, small data tables and state storage.
- I/O Density — 212 user I/O pins to support multiple interfaces and signal connections.
- Power — Operates from 1.14 V to 1.575 V, enabling designs targeting low-voltage systems.
- Package & Mounting — 281-TFBGA / CSBGA package, supplier device package 281-CSP (10×10), surface-mount for compact board-level integration.
- Operating Range — Industrial-grade operation from −40 °C to 100 °C for deployments in harsher environments.
- Compliance — RoHS compliant to meet regulatory requirements for material restrictions.
Typical Applications
- Industrial control and automation — Industrial-grade temperature range and robust I/O count make this FPGA suited for control logic, I/O aggregation and protocol handling in automation equipment.
- Embedded processing and glue logic — Mid-range logic capacity and on-chip RAM provide resources for integration tasks such as signal conditioning, bus bridging and peripheral control.
- Interface expansion — High I/O density supports designs that require a variety of digital interfaces and pin-count flexibility on compact PCBs.
Unique Advantages
- Balanced logic and memory — 3,120 logic elements paired with 36,864 bits of RAM offers a practical blend of programmable logic and embedded storage for mid-range applications.
- High I/O availability — 212 user I/Os enable multi-interface designs and flexible board-level connectivity, reducing the need for external I/O expanders.
- Industrial temperature support — Rated from −40 °C to 100 °C to address systems that must operate reliably in challenging thermal environments.
- Compact, surface-mount package — 281-TFBGA / 281-CSP (10×10) package offers a small board footprint for space-constrained applications.
- Low-voltage operation — 1.14 V to 1.575 V supply range supports designs targeting modern low-voltage power domains.
- Regulatory compliance — RoHS compliant to align with material and environmental regulations.
Why Choose AGLP125V2-CS281I?
The AGLP125V2-CS281I positions itself as a practical, industrial-grade FPGA option that combines moderate programmable logic capacity, useful on-chip RAM and a high I/O count in a compact BGA package. Its supply voltage range and temperature rating make it appropriate for embedded and industrial applications that require reliable operation across a wide temperature span.
This device is suited to engineering teams and procurement professionals designing mid-range FPGA-based systems that need a balance of integration, environmental robustness and compact board-level footprint while maintaining compliance with RoHS requirements.
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