AGLP125V2-CSG289

The AGLP125V2-CSG289 is a flash-based IGLOO PLUS FPGA from Microchip Technology, implemented on a 130 nm flash process. It delivers a single-chip, reprogrammable FPGA solution with 125,000 system gates, approximately 3,120 logic elements, and up to 212 user I/Os for commercial embedded designs.

Designed for low-power, instant-on applications, this device targets commercial and consumer embedded systems that require mixed-voltage I/O, on-chip memory, and secure in-system programming while maintaining a compact 289-TFBGA package footprint.

Key Features

• Core Logic — 125,000 system gates and approximately 3,120 logic elements provide a substantial logic fabric for control, glue-logic, and mid-density FPGA tasks.
• Embedded Memory — Approximately 36 kbits of true dual-port SRAM and 1 kbit of on-chip FlashROM for data buffering, FIFOs, and nonvolatile storage.
• Low-Power Operation — Flash*Freeze ultra-low-power mode and Low Power Active capability enable minimal quiescent power while retaining design state and I/O configuration; Flash*Freeze typical consumption for the AGLP125 device is 16 μW.
• Flexible Supply and I/O — Core supply range of 1.14 V to 1.575 V and support for mixed I/O voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) with bank-selectable I/O voltages and programmable drive strength.
• I/O Density and Features — Up to 212 user I/Os with input/output and enable path registers, selectable Schmitt triggers, weak pull-up/-down, and hot-swappable/cold-sparing capabilities.
• Security and In-System Programming — On-chip 128-bit AES decryption for JTAG-based in-system programming and FlashLock for content protection.
• Clock Conditioning and PLL — Six Clock Conditioning Circuit (CCC) blocks with one integrated PLL, supporting configurable phase shift, multiply/divide, and wide input frequency range.
• Performance — System performance support up to 250 MHz in 1.5 V systems and 160 MHz in 1.2 V systems.
• Package and Mounting — 289-TFBGA (CSBGA) 289-CSP (14×14) supplier device package, surface-mount mounting type suitable for compact board designs.
• Commercial Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.

Typical Applications

• Consumer and Commercial Embedded Systems — Use as control logic and interface glue in appliances, instrumentation, and smart devices where reprogrammability and compact packaging are required.
• Battery-Powered and Portable Devices — Low-power Flash*Freeze and Low Power Active modes enable energy-efficient system standby and wake-up control for portable products.
• Secure Control Modules — On-chip AES decryption and FlashLock support secure in-system updates and protection of programmed designs in commercial modules.
• Mixed-Voltage Sensor and Interface Hubs — Bank-selectable I/O voltages and extensive I/O count allow direct interfacing to a variety of sensors and peripherals across voltage domains.
• Prototyping and In-System Programmable Designs — Reprogrammable flash architecture and ISP capabilities simplify iterative development and field updates.

Unique Advantages

• Highly Integrated Flash FPGA: Combines nonvolatile flash configuration with on-chip SRAM and FlashROM to reduce external components and simplify board design.
• Energy-Efficient Operation: Flash*Freeze and Low Power Active modes reduce system standby power while preserving configuration and I/O state for fast recovery.
• Flexible I/O and Mixed-Voltage Support: Bank-selectable voltage support across common logic levels enables easy interfacing to peripherals without level translators.
• On-Board Security: Built-in AES decryption for JTAG ISP and FlashLock protect device contents and support secure field updates.
• Compact, Surface-Mount Package: 289-TFBGA (CSBGA) in a 14×14 supplier package enables high-density PCB layouts with robust mounting.
• Deterministic Resources: Defined gate count, logic elements, and memory capacity allow predictable resource planning for mid-density FPGA designs.

Why Choose AGLP125V2-CSG289?

The AGLP125V2-CSG289 delivers a balanced combination of mid-range logic capacity, on-chip memory, and extensive I/O in a compact, surface-mount package optimized for commercial embedded systems. Its flash-based, reprogrammable architecture provides instant-on behavior and secure in-system programming, making it suitable for designs that require field updates and nonvolatile configuration.

This part is well suited for designers seeking a low-power, mixed-voltage FPGA with integrated clock conditioning, security features, and predictable resource allocation for control, interface, and sensor-hub applications within the commercial temperature range.

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