Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AXC4036XL-1BG352IAdvanced Micro DevicesIC FPGA 288 I/O 352MBGAFPGAs352-MBGA (35x35)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
288
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
352-LBGA Exposed Pad, Metal
Supplier Device Package:
352-MBGA (35×35)
291
N/AN/AXC4036XL-1BG432CAdvanced Micro DevicesIC FPGA 288 I/O 432MBGAFPGAs432-MBGA (40x40)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
288
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
432-LBGA Exposed Pad, Metal
Supplier Device Package:
432-MBGA (40×40)
1,197
N/AN/AXC4036XL-1BG432IAdvanced Micro DevicesIC FPGA 288 I/O 432MBGAFPGAs432-MBGA (40x40)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
288
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
432-LBGA Exposed Pad, Metal
Supplier Device Package:
432-MBGA (40×40)
1,859
N/AN/AXC4036XL-1HQ160CAdvanced Micro DevicesIC FPGA 129 I/O 160QFPFPGAs160-PQFP (28x28)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
36000
Number of I/O:
129
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Qualification:
N/A
Total RAM Bits:
41472
1,362
N/AN/AXC4036XL-1HQ160IAdvanced Micro DevicesIC FPGA 129 I/O 160QFPFPGAs160-PQFP (28x28)3 V - 3.6 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
36000
Number of I/O:
129
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Qualification:
N/A
Total RAM Bits:
41472
692
XC4036XL-1HQ208CN/AXC4036XL-1HQ208CAdvanced Micro DevicesIC FPGA 160 I/O 208QFPFPGAs208-PQFP (28x28)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
160
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP Exposed Pad
Supplier Device Package:
208-PQFP (28×28)
846
XC4036XL-1HQ208IN/AXC4036XL-1HQ208IAdvanced Micro DevicesIC FPGA 160 I/O 208QFPFPGAs208-PQFP (28x28)3 V - 3.6 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
36000
Number of I/O:
160
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Qualification:
N/A
Total RAM Bits:
41472
792
N/AN/AXC4036XL-1HQ240CAdvanced Micro DevicesIC FPGA 193 I/O 240QFPFPGAs240-PQFP (32x32)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
193
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP Exposed Pad
Supplier Device Package:
240-PQFP (32×32)
1,201
N/AN/AXC4036XL-1HQ240IAdvanced Micro DevicesIC FPGA 193 I/O 240QFPFPGAs240-PQFP (32x32)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
193
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
240-BFQFP Exposed Pad
Supplier Device Package:
240-PQFP (32×32)
14
XC4036XL-1HQ304CN/AXC4036XL-1HQ304CAdvanced Micro DevicesIC FPGA 256 I/O 304PQFPFPGAs304-PQFP (40x40)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
256
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
304-BFQFP Exposed Pad
Supplier Device Package:
304-PQFP (40×40)
1,553
N/AN/AXC4036XL-2BG352CAdvanced Micro DevicesIC FPGA 288 I/O 352MBGAFPGAs352-MBGA (35x35)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
288
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
352-LBGA Exposed Pad, Metal
Supplier Device Package:
352-MBGA (35×35)
164
N/AN/AXC4036XL-2BG432CAdvanced Micro DevicesIC FPGA 288 I/O 432MBGAFPGAs432-MBGA (40x40)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
288
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
432-LBGA Exposed Pad, Metal
Supplier Device Package:
432-MBGA (40×40)
954
N/AN/AXC4036XL-2HQ160CAdvanced Micro DevicesIC FPGA 129 I/O 160QFPFPGAs160-PQFP (28x28)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
36000
Number of I/O:
129
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Qualification:
N/A
Total RAM Bits:
41472
514
XC4036XL-2HQ240CN/AXC4036XL-2HQ240CAdvanced Micro DevicesIC FPGA 193 I/O 240QFPFPGAs240-PQFP (32x32)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
36000
Number of I/O:
193
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Qualification:
N/A
Total RAM Bits:
41472
258
XC4036XL-2HQ304IN/AXC4036XL-2HQ304IAdvanced Micro DevicesIC FPGA 256 I/O 304PQFPFPGAs304-PQFP (40x40)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
256
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
304-BFQFP Exposed Pad
Supplier Device Package:
304-PQFP (40×40)
1,023
N/AN/AXC4036XL-3BG352IAdvanced Micro DevicesIC FPGA 288 I/O 352MBGAFPGAs352-MBGA (35x35)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
288
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
352-LBGA Exposed Pad, Metal
Supplier Device Package:
352-MBGA (35×35)
1,427
N/AN/AXC4036XL-3HQ160CAdvanced Micro DevicesIC FPGA 129 I/O 160QFPFPGAs160-PQFP (28x28)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Total RAM Bits:
41472
Number of I/O:
129
Number of Gates:
36000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
160-BQFP Exposed Pad
Supplier Device Package:
160-PQFP (28×28)
422
N/AN/AXC4036XL-3HQ160IAdvanced Micro DevicesIC FPGA 129 I/O 160QFPFPGAs160-PQFP (28x28)3 V - 3.6 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
36000
Number of I/O:
129
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Qualification:
N/A
Total RAM Bits:
41472
635
XC4036XL-3HQ208CN/AXC4036XL-3HQ208CAdvanced Micro DevicesIC FPGA 160 I/O 208QFPFPGAs208-PQFP (28x28)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
36000
Number of I/O:
160
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Qualification:
N/A
Total RAM Bits:
41472
27
XC4036XL-3HQ208IN/AXC4036XL-3HQ208IAdvanced Micro DevicesIC FPGA 160 I/O 208QFPFPGAs208-PQFP (28x28)3 V - 3.6 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
36000
Number of I/O:
160
Number of LABs/CLBs:
1296
Number of Logic Elements/Cells:
3078
Qualification:
N/A
Total RAM Bits:
41472
1,058

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