XC4036XL-3HQ160I

The XC4036XL-3HQ160I is a Field Programmable Gate Array (FPGA) IC from AMD in the XC4000E/X family, supplied in a 160-BQFP exposed-pad surface-mount package. It combines a mid-range logic capacity with embedded RAM and a sizeable I/O count for industrial-grade embedded logic designs.

Designed for applications that require flexible, reprogrammable logic, the device operates from a 3 V to 3.6 V supply and supports an ambient temperature range from −40 °C to 100 °C, making it suitable for a variety of industrial environments.

Key Features

• FPGA Core — Provides 3,078 logic elements to implement custom digital functions and state machines.
• Embedded Memory — Contains 41,472 bits of on-chip RAM for storage of lookup tables, FIFOs, and small data buffers.
• I/O Resources — Offers 129 general-purpose I/O pins to support multiple interface connections and parallel signalling requirements.
• Gate Equivalent — Approximately 36,000 gates of logic capacity for medium-complexity designs.
• Power — Single-supply operation from 3 V to 3.6 V to match common industrial logic rails.
• Package and Mounting — Surface-mount 160-BQFP with exposed pad; supplier device package listed as 160-PQFP (28×28 mm) for PCB footprint planning.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in harsher environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implements custom control logic and I/O aggregation where the −40 °C to 100 °C range and 129 I/O pins support robust field deployment.
• Embedded Logic and Prototyping — Provides reprogrammable logic resources (3,078 logic elements and 41,472 bits RAM) for iterative development and embedded feature integration.
• I/O-Intensive Interfaces — Suitable for designs requiring parallel interfaces or multi-channel digital signaling thanks to its high I/O count and surface-mount 160-pin package.

Unique Advantages

• Balanced Logic and Memory: 3,078 logic elements paired with 41,472 bits of embedded RAM deliver a practical combination for medium-complexity functions without external memory.
• High I/O Density: 129 I/O pins allow flexible interfacing to sensors, actuators, and peripheral devices, reducing the need for external I/O expanders.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet environmental demands in industrial systems.
• Standard Surface-Mount Packaging: 160-BQFP exposed pad (160-PQFP, 28×28) eases PCB layout and thermal management for production assemblies.
• Regulatory Compliance: RoHS compliant to support environmentally conscious product development and manufacturing flows.

Why Choose XC4036XL-3HQ160I?

The XC4036XL-3HQ160I delivers a practical mix of logic capacity, embedded RAM, and high I/O density in a robust industrial-grade package. Its electrical and thermal ratings (3 V–3.6 V supply and −40 °C to 100 °C operation) make it a suitable option for embedded designs that require reprogrammable logic with reliable field performance.

This part is well suited for engineers and procurement teams targeting mid-complexity FPGA solutions for industrial control, embedded prototyping, and I/O-intensive applications where predictable specifications and RoHS compliance are required.

Request a quote today to discuss availability, pricing, and lead times for the XC4036XL-3HQ160I.