XC4036XL-3BG352I

The XC4036XL-3BG352I is a field programmable gate array (FPGA) IC from AMD’s XC4000E/X series. It provides on-chip programmable logic and embedded memory in a compact 352-LBGA exposed pad package designed for surface-mount assembly.

With thousands of logic elements, an extensive I/O count and an industrial operating temperature range, this device targets designs that require configurable digital logic and dense I/O integration while operating from 3.0 V to 3.6 V supply rails.

Key Features

• Core Logic 3,078 logic elements available for custom digital implementations, enabling a wide range of programmable functions.
• Logic Array Blocks 1,296 LABs to organize and structure logic resources for hierarchical design.
• Gate Density Approximately 36,000 gates of logic capacity for medium-complexity digital systems.
• Embedded Memory Approximately 0.04 Mbits (41,472 bits) of on-chip RAM for small buffers, FIFOs and state storage.
• I/O Capacity 288 user I/O pins to support I/O-dense applications and multiple parallel interfaces.
• Package & Mounting 352-LBGA exposed pad, metal package (supplier device package: 352-MBGA 35×35) optimized for surface-mount PCB assembly and thermal performance.
• Power Operates from a 3.0 V to 3.6 V supply range to match common system power rails.
• Temperature & Grade Industrial grade device rated for an operating temperature range of −40°C to 100°C.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control — Use the FPGA’s logic and I/O density for deterministic control, signal processing and custom timing in industrial automation systems operating across −40°C to 100°C.
• Embedded Systems & Prototyping — Implement custom digital functions and iterate designs quickly with on-chip logic and memory in development and small-volume production.
• I/O-Intensive Interfaces — Drive parallel buses, multiple peripheral interfaces or I/O expansion tasks using the device’s 288 I/O pins.
• Communications & Instrumentation — Integrate protocol bridging, data buffering and custom logic for measurement and communications equipment requiring a compact BGA footprint.

Unique Advantages

• High logic integration: 3,078 logic elements and ~36,000 gates allow implementation of substantial custom digital functions without external glue logic.
• Significant I/O resources: 288 I/O pins reduce the need for external I/O expanders and simplify board-level routing for multi-interface designs.
• Compact, thermally aware package: 352-LBGA with exposed pad supports dense PCB layouts while providing a path for heat dissipation in space-constrained designs.
• Industrial temperature range: Rated from −40°C to 100°C to meet the environmental needs of industrial and harsh-environment applications.
• Flexible power compatibility: 3.0 V to 3.6 V supply range aligns with common system rails for straightforward integration.
• RoHS compliant: Supports environmentally driven assembly and regulatory requirements.

Why Choose XC4036XL-3BG352I?

The XC4036XL-3BG352I balances programmable logic capacity, embedded memory and a high I/O count in a compact 352-LBGA package from AMD. Its industrial temperature rating and 3.0–3.6 V supply compatibility make it suitable for designs that require reliable programmable logic with robust I/O integration.

This device is well suited to engineering teams developing control, interface and mid-complexity digital systems that benefit from on-chip reconfigurability, compact packaging and industrial-grade operating range.

Request a quote or submit your requirements to receive pricing and availability for the XC4036XL-3BG352I. Our team can assist with lead times and ordering information.