XC4036XL-3HQ208I

The XC4036XL-3HQ208I is a field programmable gate array (FPGA) IC from AMD's XC4000E/X family. It provides on-chip programmable logic, embedded RAM, and a substantial I/O count in a surface-mount 208-BFQFP exposed pad package.

Designed for industrial-grade applications, the device offers 3.0–3.6 V supply operation and an extended operating range from −40 °C to 100 °C, supporting deployments that require reliable programmable logic and memory resources on a single IC.

Key Features

• Core Logic — 3,078 logic elements (logic cells) and an equivalent gate count of 36,000 provide the foundation for implementing custom digital functions.
• Embedded Memory — Approximately 41,472 bits of on-chip RAM enable local data buffering and state storage for implemented logic blocks.
• I/O Capacity — 160 user I/O pins support broad interfacing options for external peripherals and system signals.
• Power — Operates from a 3 V to 3.6 V supply range to match common 3.3 V system rails.
• Package & Mounting — 208-BFQFP exposed pad package (supplier device package: 208-PQFP (28×28)), surface-mountable for compact PCB assembly.
• Temperature & Grade — Industrial grade device rated for −40 °C to 100 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom Logic Implementation — Implement tailored digital functions using 3,078 logic elements and on-chip RAM for glue logic, protocol bridging, or small-scale state machines.
• I/O-Intensive Interfaces — Leverage 160 I/O pins to connect sensors, peripherals, or parallel buses in embedded systems.
• Industrial Embedded Systems — Industrial-grade temperature rating and surface-mount packaging suit control and monitoring applications that require robust operation across wide temperature ranges.
• Compact PCB Designs — 208-BFQFP exposed pad package supports dense board layouts and thermal management in space-constrained designs.

Unique Advantages

• Balanced Logic and Memory: A combination of 3,078 logic elements and ~41,472 bits of RAM lets you implement both combinational/sequential logic and local data storage on-chip.
• High I/O Count: 160 I/O pins provide flexibility for interfacing multiple peripherals without external I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in demanding environmental conditions.
• Standard Surface-Mount Package: 208-BFQFP exposed pad package simplifies assembly and thermal dissipation for compact designs.
• RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.
• 3.0–3.6 V Supply Compatibility: Works with common 3.3 V system rails for straightforward integration into existing power architectures.

Why Choose XC4036XL-3HQ208I?

The XC4036XL-3HQ208I combines on-chip logic capacity, embedded RAM, and a large I/O complement in a single industrial-grade FPGA package. Its specification set — including 3,078 logic elements, ~41,472 bits of RAM, 160 I/O, 3.0–3.6 V operation, and −40 °C to 100 °C temperature rating — makes it suited to designs that require reliable programmable logic and local memory in a compact surface-mount form factor.

This part is ideal for engineers and procurement teams building embedded systems that need integrated logic and memory resources with robust temperature performance and RoHS compliance, enabling scalable, long-lived deployments with straightforward board-level integration.

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