XC4036XL-2BG352C

The XC4036XL-2BG352C is a Field Programmable Gate Array (FPGA) IC from AMD's XC4000E/X family. It provides a mix of programmable logic resources, embedded RAM, and high I/O density in a 352‑lead LBGA exposed‑pad package for surface‑mount applications.

Designed for commercial‑grade applications, this device delivers configurable logic (CLBs), on‑chip RAM, and extensive I/O capability while operating from a 3.0 V to 3.6 V supply and across a 0 °C to 85 °C temperature range.

Key Features

• Core Logic  1,296 CLBs and 3,078 logic element cells provide the device's programmable logic capacity, supporting combinational and sequential logic implementation.
• Embedded Memory  41,472 total RAM bits of on‑chip memory for small buffers, state storage, and local data handling.
• I/O Capacity  288 dedicated I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Gate Count  Approximately 36,000 gates available for implementing complex logic functions and glue logic.
• Power and Supply  Operates from a 3.0 V to 3.6 V supply range to match common system power rails.
• Package and Mounting  352‑LBGA exposed pad, metal package (supplier package: 352‑MBGA 35×35) designed for surface‑mount assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial environment applications.
• Compliance  RoHS‑compliant material construction.

Typical Applications

• Interface and Glue Logic  Use the device's 288 I/O and extensive logic resources to implement bus bridging, protocol adaptation, and peripheral interfacing.
• Control and State Machines  Leverage 1,296 CLBs and on‑chip RAM to implement control logic, finite state machines, and timing-critical sequencers.
• Prototyping and Development  Suitable for evaluation boards and medium‑complexity prototype designs that require reprogrammable logic and moderate embedded memory.

Unique Advantages

• Balanced Logic and Memory: The combination of 1,296 CLBs, 3,078 logic element cells, and 41,472 RAM bits supports mixed logic and local data storage within a single device.
• High I/O Density: 288 I/O pins enable broad external connectivity without additional I/O expanders, simplifying board design.
• Compact, Surface‑Mount Package: The 352‑LBGA exposed‑pad package offers a compact form factor with thermal grounding for surface‑mount assembly.
• Standard Supply Voltage: Operation at 3.0 V to 3.6 V aligns with common system rails, easing power‑supply integration.
• Commercial Temperature Range: Specified 0 °C to 85 °C operation for deployments in commercial environments.
• Regulatory Compliance: RoHS‑compliant construction supports environmental and manufacturing requirements.

Why Choose XC4036XL-2BG352C?

The XC4036XL-2BG352C positions itself as a flexible, mid‑density FPGA option for commercial applications that require a balance of programmable logic, on‑chip RAM, and high I/O count in a compact surface‑mount package. Its specified voltage range, CLB and logic cell resources, and substantial I/O capacity make it well suited to designs needing reconfigurable digital logic and local data storage without external memory.

This device is appropriate for engineers and teams developing interface logic, control systems, or prototype designs where commercial temperature operation and RoHS compliance are required. The 352‑LBGA package provides a space‑efficient footprint for modern printed circuit boards.

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