XC4036XL-1HQ240I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 193 41472 3078 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 718 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 193 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1296 | Number of Logic Elements/Cells | 3078 | ||
| Number of Gates | 36000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41472 |
Overview of XC4036XL-1HQ240I – XC4000E/X Field Programmable Gate Array (FPGA) IC, 240-BFQFP Exposed Pad
The XC4036XL-1HQ240I is an AMD XC4000E/X family FPGA packaged in a 240-BFQFP with exposed pad. It provides on-chip logic and memory resources with a high I/O count in a surface-mount industrial-grade package.
Designed for systems requiring configurable digital logic at 3.0–3.6 V operation and wide temperature tolerance, this device targets industrial applications where robustness and predictable thermal/packaging characteristics are important.
Key Features
- Core Logic — 3,078 logic elements (approximately 36,000 gates) organized for flexible implementation of custom digital functions.
- Logic Array Blocks — 1,296 LABs for structured logic partitioning and design mapping.
- Embedded Memory — 41,472 bits of on-chip RAM (approximately 0.041 Mbits) to support buffering, state storage, and small data tables.
- I/O Density — 193 general-purpose I/O pins to interface with peripherals, sensors, and other system components.
- Package & Mounting — 240-BFQFP exposed pad (supplier device package: 240-PQFP, 32×32) in a surface-mount form factor for standard PCB assembly and improved thermal path.
- Power & Temperature — Operates from 3 V to 3.6 V and specified for an operating temperature range of −40 °C to 100 °C, supporting industrial-temperature deployments.
- Compliance — RoHS compliant for lead-free manufacturing environments.
Unique Advantages
- High logic capacity: 3,078 logic elements and 1,296 LABs enable implementation of moderately complex custom logic without external gate arrays.
- Substantial I/O count: 193 I/O pins allow direct connection to a wide range of external devices, reducing the need for additional I/O expanders.
- On-chip memory for control and buffering: 41,472 bits of embedded RAM support local buffering and state storage to simplify system architecture.
- Industrial temperature range: Specified operation from −40 °C to 100 °C supports deployment in harsher environments common to industrial applications.
- Thermally conscious package: Exposed pad 240-BFQFP with a 32×32 PQFP footprint provides a direct thermal path for improved heat dissipation on populated PCBs.
- RoHS compliant: Suitable for lead-free production processes and environmentally conscious manufacturing flows.
Why Choose XC4036XL-1HQ240I?
The XC4036XL-1HQ240I balances a significant logic and I/O resource set with on-chip RAM in an industrial-grade, surface-mount package. Its combination of 3,078 logic elements, 193 I/Os, and an exposed-pad 240-BFQFP footprint makes it well suited for embedded designs that require configurable digital logic and robust thermal packaging.
Manufactured by AMD and specified for 3.0–3.6 V operation and −40 °C to 100 °C operation, this FPGA provides a compact, RoHS-compliant option for designers and procurement teams targeting industrial deployments where predictable electrical and thermal characteristics are required.
Request a quote or submit an inquiry for XC4036XL-1HQ240I to get pricing, availability, and lead-time information for your next design.

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