XC4036XL-1BG352I

The XC4036XL-1BG352I is a member of the XC4000E/X family of field programmable gate array (FPGA) devices. It provides mid-range programmable logic capacity with integrated on-chip RAM and a large number of I/O in a 352-ball L‑BGA package aimed at industrial applications.

Designed for surface-mount assembly and RoHS-compliant manufacturing, this device supports operation from a 3.0 V to 3.6 V supply and across an industrial temperature range of −40 °C to 100 °C.

Key Features

• Core / Logic Approximately 3,078 logic elements implemented across the device to support custom digital designs.
• Logic Array Blocks 1,296 LABs provide structured resources for implementing combinational and sequential logic.
• Embedded Memory Approximately 0.041 Mbits (41,472 bits) of on-chip RAM for data buffering, FIFOs, and small memory structures.
• I/O Capacity 288 user I/O pins to support wide parallel interfaces and multiple external peripherals.
• Gate Count Approximately 36,000 gates for mid-density logic integration and glue logic consolidation.
• Power Single-supply operation from 3.0 V to 3.6 V to match common system power rails.
• Package & Mounting 352‑LBGA exposed pad, metal package (352‑MBGA, 35×35) for surface-mount PCB assembly and improved thermal conduction.
• Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS-compliant to support environmentally conscious manufacturing and assembly.

Typical Applications

• Industrial control systems — Leverages industrial temperature rating and extensive I/O for control and interface tasks in automation equipment.
• I/O‑intensive designs — High pin count (288 I/O) enables parallel data paths, sensor/actuator interfacing, and multi-channel connectivity.
• Custom digital logic and prototyping — Mid-range logic capacity and on-chip memory allow consolidation of glue logic, protocol handling, and early-stage hardware validation.

Unique Advantages

• Balanced mid-range integration: Approximately 3,078 logic elements and ~36,000 gates provide enough density for moderate-complexity designs without excess cost or board area.
• Significant I/O headroom: 288 user I/O pins simplify integration with multiple peripherals and parallel interfaces, reducing the need for external I/O expanders.
• Embedded RAM for on-chip buffering: ~0.041 Mbits of RAM supports local data storage for FIFOs, registers, and temporary buffers, reducing external memory dependence.
• Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet harsher environmental requirements.
• Compact, thermally-conscious package: 352-LBGA with exposed pad and metal construction supports surface-mount assembly while aiding thermal dissipation.
• RoHS-compliant: Enables use in assemblies targeting regulated environmental standards.

Why Choose XC4036XL-1BG352I?

The XC4036XL-1BG352I positions itself as a practical choice for engineers needing a mid-density FPGA with substantial I/O and on-chip memory, packaged for surface-mount industrial applications. Its combination of roughly 3,078 logic elements, 288 I/O, and industrial temperature rating makes it suitable for control, interfacing, and custom digital logic tasks where reliability and integration matter.

For teams focused on reducing board-level component count while maintaining flexibility, this device offers a balance of integration, thermal-aware packaging, and RoHS compliance to support long-term production and environmental requirements.

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