XC4036XL-09HQ208C
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 160 41472 3078 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 596 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 160 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1296 | Number of Logic Elements/Cells | 3078 | ||
| Number of Gates | 36000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41472 |
Overview of XC4036XL-09HQ208C – XC4000E/X Field Programmable Gate Array (FPGA) IC, 160 I/O, 208-BFQFP
The XC4036XL-09HQ208C is an AMD XC4000E/X series Field Programmable Gate Array (FPGA) supplied in a 208-BFQFP exposed pad package. It provides a balanced combination of logic capacity, on-chip RAM and I/O count for commercial electronic designs requiring configurable digital logic and multiple external interfaces.
Key electrical and environmental characteristics include a 3 V to 3.6 V supply range and a commercial operating temperature range of 0 °C to 85 °C, with RoHS compliance for regulatory suitability.
Key Features
- Logic Capacity Approximately 3,078 logic elements and 36,000 gates to implement medium-scale digital functions and glue logic.
- Embedded Memory Approximately 41.5 kbits (41,472 bits) of on-chip RAM for small buffering, FIFOs or state storage.
- I/O Density 160 user I/O pins provide extensive external connectivity for peripherals, sensors and interface logic.
- Core Voltage Operates from 3.0 V to 3.6 V, supporting designs that run on standard 3 V-class power rails.
- Package and Mounting 208-BFQFP exposed pad package (supplier device package listed as 208-PQFP, 28×28) in a surface-mount form factor for PCB assembly.
- Temperature and Grade Commercial-grade device rated for 0 °C to 85 °C operation, suitable for general-purpose consumer and commercial applications.
- Environmental Compliance RoHS compliant, meeting common environmental substance regulations.
Typical Applications
- Interface Bridging Use the 160 I/O pins to implement parallel/serial interface translation and protocol bridging in commercial equipment.
- Control and Glue Logic Deploy the available logic elements and gates to consolidate discrete glue logic and control functions on a single FPGA.
- Prototyping and Development Suitable for proof-of-concept and functional prototyping where moderate logic density and on-chip RAM are required.
- Peripheral Aggregation Aggregate multiple peripheral signals and implement custom I/O timing or simple preprocessing using the device’s I/O and logic resources.
Unique Advantages
- Balanced Logic and Memory: Combines ~3,078 logic elements with ~41.5 kbits of RAM to support both control logic and modest on-chip buffering without external memory.
- High I/O Count: 160 I/O pins reduce the need for additional I/O expanders when connecting multiple peripherals or interfaces.
- Standard 3 V Supply: 3.0 V–3.6 V operation aligns with common 3 V-class systems, simplifying power supply design.
- Surface-Mount, Exposed Pad Package: 208-BFQFP exposed pad package supports compact PCB layouts and thermal conduction through the exposed pad.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C, matching typical environmental requirements for consumer and commercial products.
- RoHS Compliant: Meets common environmental substance regulations for electronics manufacturing.
Why Choose XC4036XL-09HQ208C?
The XC4036XL-09HQ208C is positioned for designers who need a moderate-density FPGA with substantial I/O and integrated RAM for commercial electronic applications. Its combination of approximately 3,078 logic elements, ~41.5 kbits of embedded memory, and 160 I/O pins offers a practical balance of integration and board-level flexibility.
This device suits teams building control logic, interface solutions, and prototypes that run on standard 3 V-class supplies and operate within commercial temperature ranges. RoHS compliance and a surface-mount 208-BFQFP exposed pad package support contemporary manufacturing and assembly processes.
Request a quote or submit your requirements to receive pricing and availability for the XC4036XL-09HQ208C. Our team will respond with a tailored quote and lead-time information.

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