XC4036XL-09BG352C

The XC4036XL-09BG352C is a Field Programmable Gate Array (FPGA) IC from AMD in the XC4000E/X family. It provides a mid-range logic capacity with a combination of on-chip memory, a high I/O count and a compact BGA package for commercial embedded designs.

Key device attributes include approximately 3,078 logic elements, 41,472 bits of on-chip RAM, 288 user I/O pins, a 352-pin metal LBGA package with exposed pad, and a 3.0–3.6 V supply range. The device is specified for commercial temperature operation (0 °C to 85 °C) and is RoHS compliant.

Key Features

• Logic Capacity  Approximately 3,078 logic elements and 1,296 logic blocks provide the programmable fabric for custom digital functions.
• Embedded Memory  41,472 total on-chip RAM bits for buffering, small lookup tables, and local storage.
• I/O Resources  288 user I/O pins to support parallel interfaces, multiple peripherals, and high-density signal routing.
• Gate Count  36,000 gates to describe overall device complexity and integration potential.
• Package & Mounting  352-LBGA exposed pad, metal construction in a 352-MBGA (35×35) supplier device package; surface-mount mounting type for compact PCB integration.
• Power & Temperature  Operates from a 3.0 V to 3.6 V supply and is specified for commercial-grade operation from 0 °C to 85 °C.
• Environmental  RoHS compliant for regulatory environmental requirements.

Typical Applications

• Consumer and Commercial Electronics  Use the FPGA for custom control logic, peripheral interfacing, and feature integration in commercial devices within the specified temperature range.
• Prototyping and Development  Mid-range logic density and abundant I/O make the device suitable for proof-of-concept designs and functional prototyping.
• Interface Bridging and Signal Routing  High I/O count supports protocol conversion, bus interfacing, and routing between multiple digital subsystems.

Unique Advantages

• High I/O Density:  288 I/O pins enable connection to many peripherals and parallel interfaces without external multiplexing.
• Balanced Logic and Memory:  Approximately 3,078 logic elements combined with 41,472 RAM bits support both control logic and local buffering needs.
• Compact BGA Package:  352-LBGA exposed pad packaging reduces PCB footprint while providing thermal performance suitable for surface-mount assembly.
• Commercial Temperature Rating:  Specified 0 °C to 85 °C range aligns the device with a wide range of commercial applications.
• Regulatory Compliance:  RoHS compliance simplifies environmental and materials management for product designs.

Why Choose XC4036XL-09BG352C?

The XC4036XL-09BG352C offers a balanced combination of logic density, embedded memory, and a high number of I/O in a compact 352-LBGA package, making it well suited for commercial embedded designs that require moderate programmable logic and extensive interfacing. Its 3.0–3.6 V supply range, commercial temperature rating, and RoHS compliance provide a stable platform for product development and deployment in commercial environments.

This device is a practical choice for designers seeking to integrate custom digital functions, interface-rich subsystems, or prototype complex logic in a compact form factor backed by AMD’s FPGA family pedigree.

If you would like pricing or availability for XC4036XL-09BG352C, request a quote or submit your purchase inquiry and our team will respond with a formal quotation and delivery information.