XC4036EX-3HQ240C

The XC4036EX-3HQ240C is a Field Programmable Gate Array (FPGA) IC from AMD in a 240-pin BFQFP exposed pad package. It provides a mix of on-chip logic, embedded RAM, and I/O resources for commercial embedded designs.

Key device attributes include 1,296 logic blocks, 3,078 logic elements, 41,472 bits of on-chip RAM, 193 user I/Os, a 4.75 V to 5.25 V supply range, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and intended for surface-mount applications.

Key Features

• Core Logic  Contains 1,296 logic blocks and 3,078 logic elements, enabling implementation of medium-complexity digital functions and custom logic.
• Gate Count  Approximately 36,000 gates to support sizeable combinational and sequential logic designs.
• Embedded Memory  Total on-chip RAM of 41,472 bits (approximately 0.041 Mbits) for distributed storage and buffering.
• I/O Resources  193 user I/Os to interface with external peripherals, sensors, and buses in board-level systems.
• Power  Nominal supply range of 4.75 V to 5.25 V to match common 5 V system rails.
• Package and Mounting  240-BFQFP exposed pad package (supplier device package: 240-PQFP, 32×32) designed for surface-mount assembly and thermal conduction through the exposed pad.
• Commercial Grade & Temperature Range  Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for lead-free assembly processes.

Unique Advantages

• Balanced logic and memory resources: The combination of 3,078 logic elements and 41,472 bits of RAM supports mixed logic and buffering requirements without external memory in many designs.
• High I/O count: 193 I/Os provide ample connectivity for multi-signal interfaces and parallel peripheral integration.
• Standard 5 V compatibility: Operates from 4.75 V to 5.25 V, simplifying integration into existing 5 V system architectures.
• Surface-mount BFQFP with exposed pad: The 240-pin exposed pad package helps with board-level thermal performance and accommodates compact PCB layouts.
• Commercial operating range: Rated 0 °C to 85 °C for a wide array of commercial and industrial-adjacent applications where this temperature range is appropriate.
• RoHS compliant: Supports lead-free manufacturing and environmental compliance requirements.

Why Choose XC4036EX-3HQ240C?

The XC4036EX-3HQ240C delivers a practical balance of logic density, on-chip memory, and high I/O count in a compact 240-pin BFQFP exposed pad package. It is well suited to designers and procurement teams building commercial embedded systems that require a moderate number of logic elements, significant I/O, and integrated RAM while operating on standard 5 V rails.

With RoHS compliance and surface-mount packaging, the device supports modern assembly flows and board-level thermal management. Choose the XC4036EX-3HQ240C when you need a field-programmable solution that aligns resource counts and package characteristics to commercial embedded design requirements.

Request a quote or submit a product inquiry to check availability and pricing for the XC4036EX-3HQ240C.