XC4028XLA-09BGG352C

The XC4028XLA-09BGG352C is a Field Programmable Gate Array (FPGA) IC in the XC4000XLA family from AMD. It provides 1,024 CLBs and 2,432 logic elements, 32,768 bits of on-chip RAM and 256 I/O pins in a compact 352-LBGA exposed pad package.

Designed for commercial-grade embedded designs, the device operates from 3.0 V to 3.6 V and across a 0 °C to 85 °C operating range, offering a balance of logic capacity, on-chip memory and signal I/O for a variety of mid-density digital applications.

Key Features

• Logic Fabric 1,024 CLBs and 2,432 logic elements/cells providing approximately 28,000 gates for implementing custom digital logic.
• Embedded Memory 32,768 bits of on-chip RAM for localized data storage and state retention within designs.
• I/O Count 256 general-purpose I/O pins to support multiple peripherals, interfaces and bus connections.
• Package & Mounting 352-LBGA exposed pad, metal package (supplier device package: 352-MBGA, 35×35) with surface-mount mounting for dense PCB integration.
• Power Operates from 3.0 V to 3.6 V supply rails suitable for common commercial power domains.
• Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Commercial Embedded Control — Implement control logic and state machines in commercial embedded products that fit the device’s operating temperature and voltage ranges.
• I/O-Intensive Interfaces — Use the 256 I/O pins for peripheral aggregation, sensor interfaces or bridging multiple buses in compact systems.
• Prototyping and Development — Suitable for prototyping designs that require roughly 2,432 logic elements and on-chip RAM for verification and iteration.
• Glue Logic and Custom Functions — Implement custom glue logic, protocol conversion and moderate-density digital processing without adding multiple discrete components.

Unique Advantages

• Balanced Logic and Memory Capacity: Combines 2,432 logic elements with 32,768 bits of embedded RAM to support integrated digital functions and localized data buffering.
• High I/O Density: 256 I/O pins enable broad device interfacing and flexible system-level connectivity.
• Compact, Thermally-Aware Package: 352-LBGA exposed pad, metal package in a 35×35 supplier footprint supports surface-mount assembly while providing a thermal return path through the exposed pad.
• Commercial Voltage and Temperature Compatibility: 3.0–3.6 V supply range and 0 °C to 85 °C rating align with many commercial electronic product requirements.
• RoHS Compliance: Designed for lead-free assembly to meet environmental and manufacturing requirements.

Why Choose XC4028XLA-09BGG352C?

The XC4028XLA-09BGG352C offers a practical combination of logic density, embedded memory and high I/O count in a compact LBGA package, making it a suitable option for commercial embedded designs that require moderate integration without large-scale FPGA resources. Its commercial temperature rating and 3.0–3.6 V supply compatibility make it straightforward to integrate into existing commercial product stacks.

As a member of the XC4000XLA family from AMD, the device provides a predictable platform for designs that need scalable logic and memory resources in a surface-mount 352-LBGA form factor, supporting streamlined BOMs and PCB layouts.

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