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Total Products: 3,239
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8572EVTAULEMPC8572EVTAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BFBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
1,430
MPC8572EVTAVNBMPC8572EVTAVNBNXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Mounting Type:
Surface Mount
959
MPC8572EVTAVNEMPC8572EVTAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BFBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
211
N/AMPC8572LVJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
559
N/AMPC8572LVJAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
611
MPC8572LVTAVNEMPC8572LVTAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BFBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
798
N/AMPC8572VJATLENXP SemiconductorsIC MPU MPC85XX 1.2GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
405
N/AMPC8572VJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
1,950
N/AMPC8572VJAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
958
MPC8572VTAULEMPC8572VTAULENXP SemiconductorsMPC8572 - POWERQUICC III 32-BITMicroprocessorsN/AN/AN/A
Voltage – I/O:
1.5 V – 3.3 V
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
1,083
MPC857DSLCVR66BMPC857DSLCVR66BNXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 115°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 115°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
788
MPC857DSLVR50BMPC857DSLVR50BNXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
1,166
MPC857TCVR66BMPC857TCVR66BNXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 115°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 115°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
149
MPC857TVR100BMPC857TVR100BNXP SemiconductorsIC MPU MPC8XX 100MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
281
MPC857TVR50BMPC857TVR50BNXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
1,651
MPC857TVR80BMPC857TVR80BNXP SemiconductorsIC MPU MPC8XX 80MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
80MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
482
MPC857TZQ100BMPC857TZQ100BNXP SemiconductorsIC MPU MPC8XX 100MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
1,150
MPC859DSLVR50AMPC859DSLVR50ANXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
993
MPC859DSLVR66AMPC859DSLVR66ANXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
159
MPC859DSLVR66A-NXPMPC859DSLVR66A-NXPNXP SemiconductorsPOWERQUICC 32 BIT POWER ARCHITECMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
152

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