MPC857DSLCVR66B

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 788 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC857
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 115°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC857DSLCVR66B – IC MPU MPC8XX 66MHZ 357BGA

The MPC857DSLCVR66B is a single-core, 32-bit microprocessor based on the MPC8xx family and PowerPC architecture. Running at 66 MHz, it integrates communication-oriented peripherals and memory controllers to support embedded controller and networking applications in industrial environments.

Designed for embedded and communications systems, this device combines a PowerPC-compatible core with on-chip communications processing, Ethernet interfaces, and DRAM support to simplify system design and reduce component count.

Key Features

  • Core and Architecture  Embedded single-issue, 32-bit MPC8xx core implementing the PowerPC architecture at 66 MHz for deterministic embedded processing.
  • Caches and MMU  Implements cache and memory-management features from the MPC8xx family; MPC857DSL variants use 4 KB instruction and 4 KB data caches with set-associative organization and a 32-entry TLB for virtual memory support.
  • Communications Processing (CPM)  Integrated communications coprocessor functionality to accelerate protocol handling and offload host CPU tasks for networking and control applications.
  • Ethernet Connectivity  Dual Ethernet capability with one 10 Mbps port and one 10/100 Mbps port to support diverse network link requirements.
  • Memory and DRAM Controller  On-chip DRAM controller to interface with system memory, simplifying board-level memory design.
  • System Interfaces  Additional serial interfaces including I2C for peripheral control and system management.
  • Power and I/O  3.3 V I/O signaling for compatibility with standard embedded I/O levels.
  • Package and Mounting  357-pin PBGA (25 × 25 mm) surface-mount package for compact, high-density board designs.
  • Industrial Qualification & Temperature Range  Industrial-qualified device rated for operation from −40 °C to 115 °C for deployment in extended-temperature environments.
  • Regulatory  RoHS compliant to meet lead-free assembly requirements.

Typical Applications

  • Communications Equipment  Embedded protocol handling and dual Ethernet make the MPC857DSLCVR66B suitable for routers, gateways, and line card controllers.
  • Networking Systems  Use for network interface processing and control planes requiring integrated CPM and Ethernet connectivity.
  • Industrial Controllers  On-chip DRAM controller, robust temperature rating, and 3.3 V I/O support factory automation and process-control applications.
  • Embedded Processing Platforms  Single-core PowerPC architecture and MMU/caching features support general-purpose embedded computing and system management tasks.

Unique Advantages

  • Integrated Communications Subsystem: On-chip CPM and communications DSP functionality reduce external components and offload packet and protocol processing from the main core.
  • Dual Ethernet Links: A mix of 10 Mbps and 10/100 Mbps Ethernet ports provides flexible connectivity options for mixed-rate network designs.
  • Industrial Temperature Range: Rated from −40 °C to 115 °C for reliable operation in harsh and temperature-critical installations.
  • Compact PBGA Package: The 357-pin 25 × 25 mm PBGA package enables dense board layouts while providing the pin count required for rich peripheral integration.
  • PowerPC-based Architecture with MMU: Processor architecture and MMU/TLB support enable advanced memory protection and virtual memory schemes for embedded OS or real-time environments.
  • RoHS Compliant and 3.3 V I/O: Ensures compliance with lead-free assembly processes and compatibility with standard embedded I/O voltage domains.

Why Choose MPC857DSLCVR66B?

The MPC857DSLCVR66B positions itself as a purpose-built embedded communications processor combining a PowerPC-compatible MPC8xx core, integrated communications processing, DRAM interface, and dual Ethernet connectivity. Its industrial qualification and extended operating temperature range make it well suited to rugged networking and control applications where thermal endurance and on-chip integration reduce system complexity.

For designers targeting compact, reliable embedded systems requiring protocol acceleration and standard I/O signaling, the MPC857DSLCVR66B offers a balanced mix of processing, peripheral integration, and environmental robustness backed by the MPC857 series hardware specifications.

Request a quote or submit a sales inquiry to discuss availability, volume pricing, and lead times for the MPC857DSLCVR66B.

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