MPC857TVR100B
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 281 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC857 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (1), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 100MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC857TVR100B – IC MPU MPC8XX 100MHz 357BGA
The MPC857TVR100B is a single-core, 32-bit microprocessor in the MPC8xx family implementing the PowerPC architecture. It integrates core processing, packet/communication offload and system I/O to address embedded controller, communications and networking applications.
Running at 100 MHz with 3.3 V I/O, the device combines on-chip communications processing (CPM), DRAM controller support and multiple Ethernet interfaces to simplify system design and deliver a compact, surface-mount solution in a 357‑pin PBGA (25×25) package.
Key Features
- Core & Architecture Embedded single-issue, 32-bit MPC8xx core implementing the PowerPC architecture with branch prediction and standard PowerPC register/TLB structures as used across the MPC862/857T family.
- Memory & MMU On-chip caches and MMU features from the MPC8xx family (including set-associative instruction/data caches and a 32-entry TLB) provide efficient code and data handling for embedded workloads.
- Communications Co-Processor (CPM) Integrated CPM supports communications and DSP-style offload for packet processing and protocol handling.
- Ethernet Connectivity Dual Ethernet capability including one 10 Mbps port and one 10/100 Mbps port to support mixed-speed network designs.
- System Interfaces Built-in DRAM controller support and additional serial/protocol interfaces including HDLC/SDLC for common embedded communications protocols.
- Performance & Power 100 MHz core frequency with 3.3 V I/O operating voltage suitable for a range of embedded power envelopes.
- Package & Mounting Surface-mount 357‑pin PBGA (25×25) package for compact board-level integration.
- Operating Range & Compliance Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C and RoHS compliance for environmental requirements.
Typical Applications
- Communications Equipment Use the integrated CPM and Ethernet ports for protocol processing and medium-speed packet handling in routers, gateways and access equipment.
- Embedded Networking Appliances Ideal for compact network appliances that require on-chip DRAM interface and mixed 10/100 Mbps Ethernet connectivity.
- Control and Automation Systems Single-core 32-bit processing with serial protocol support (HDLC/SDLC) suits protocol translation, controller and protocol offload tasks in embedded controllers.
- Consumer Connectivity Devices Consumer-grade qualification and RoHS compliance make it suitable for consumer networking and connectivity products requiring integrated communications features.
Unique Advantages
- Integrated Communications Subsystem: On-chip CPM and HDLC/SDLC interfaces reduce external components and simplify designs that need protocol handling and serial communications.
- Dual Ethernet Support: Built-in 10 Mbps and 10/100 Mbps Ethernet ports provide flexibility for mixed-speed network deployments without additional PHYs.
- PowerPC-Based MPC8xx Core: The established MPC8xx PowerPC architecture delivers predictable 32-bit processing behavior and MMU/cache features for embedded software stacks.
- Compact Surface-Mount Package: 357‑pin PBGA (25×25) enables high-density board layouts while preserving necessary I/O for system integration.
- Consumer Qualification & RoHS Compliance: Consumer-level qualification and RoHS compliance streamline use in consumer electronics and ensure regulatory conformity.
- Extended Operating Temperature: Rated 0 °C to 105 °C to support a range of deployment environments within consumer and industrial-adjacent products.
Why Choose MPC857TVR100B?
The MPC857TVR100B positions itself as a compact, integrated processor for embedded communications and controller designs that benefit from on-chip CPM, DRAM interface support and dual Ethernet connectivity. Its MPC8xx PowerPC core and family-level cache/MMU features provide a familiar architecture for embedded software and protocol stacks.
This part is well suited for designers seeking a surface-mount, RoHS‑compliant solution with built-in communications peripherals and 3.3 V I/O. It delivers a balance of integration and deterministic 32‑bit processing for consumer-grade networking and embedded applications.
Request a quote or submit a product inquiry to receive pricing, availability and technical assistance for MPC857TVR100B.

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