MPC857TVR100B

IC MPU MPC8XX 100MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 357-PBGA (25x25)

Quantity 281 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC857
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed100MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC857TVR100B – IC MPU MPC8XX 100MHz 357BGA

The MPC857TVR100B is a single-core, 32-bit microprocessor in the MPC8xx family implementing the PowerPC architecture. It integrates core processing, packet/communication offload and system I/O to address embedded controller, communications and networking applications.

Running at 100 MHz with 3.3 V I/O, the device combines on-chip communications processing (CPM), DRAM controller support and multiple Ethernet interfaces to simplify system design and deliver a compact, surface-mount solution in a 357‑pin PBGA (25×25) package.

Key Features

  • Core & Architecture  Embedded single-issue, 32-bit MPC8xx core implementing the PowerPC architecture with branch prediction and standard PowerPC register/TLB structures as used across the MPC862/857T family.
  • Memory & MMU  On-chip caches and MMU features from the MPC8xx family (including set-associative instruction/data caches and a 32-entry TLB) provide efficient code and data handling for embedded workloads.
  • Communications Co-Processor (CPM)  Integrated CPM supports communications and DSP-style offload for packet processing and protocol handling.
  • Ethernet Connectivity  Dual Ethernet capability including one 10 Mbps port and one 10/100 Mbps port to support mixed-speed network designs.
  • System Interfaces  Built-in DRAM controller support and additional serial/protocol interfaces including HDLC/SDLC for common embedded communications protocols.
  • Performance & Power  100 MHz core frequency with 3.3 V I/O operating voltage suitable for a range of embedded power envelopes.
  • Package & Mounting  Surface-mount 357‑pin PBGA (25×25) package for compact board-level integration.
  • Operating Range & Compliance  Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C and RoHS compliance for environmental requirements.

Typical Applications

  • Communications Equipment  Use the integrated CPM and Ethernet ports for protocol processing and medium-speed packet handling in routers, gateways and access equipment.
  • Embedded Networking Appliances  Ideal for compact network appliances that require on-chip DRAM interface and mixed 10/100 Mbps Ethernet connectivity.
  • Control and Automation Systems  Single-core 32-bit processing with serial protocol support (HDLC/SDLC) suits protocol translation, controller and protocol offload tasks in embedded controllers.
  • Consumer Connectivity Devices  Consumer-grade qualification and RoHS compliance make it suitable for consumer networking and connectivity products requiring integrated communications features.

Unique Advantages

  • Integrated Communications Subsystem: On-chip CPM and HDLC/SDLC interfaces reduce external components and simplify designs that need protocol handling and serial communications.
  • Dual Ethernet Support: Built-in 10 Mbps and 10/100 Mbps Ethernet ports provide flexibility for mixed-speed network deployments without additional PHYs.
  • PowerPC-Based MPC8xx Core: The established MPC8xx PowerPC architecture delivers predictable 32-bit processing behavior and MMU/cache features for embedded software stacks.
  • Compact Surface-Mount Package: 357‑pin PBGA (25×25) enables high-density board layouts while preserving necessary I/O for system integration.
  • Consumer Qualification & RoHS Compliance: Consumer-level qualification and RoHS compliance streamline use in consumer electronics and ensure regulatory conformity.
  • Extended Operating Temperature: Rated 0 °C to 105 °C to support a range of deployment environments within consumer and industrial-adjacent products.

Why Choose MPC857TVR100B?

The MPC857TVR100B positions itself as a compact, integrated processor for embedded communications and controller designs that benefit from on-chip CPM, DRAM interface support and dual Ethernet connectivity. Its MPC8xx PowerPC core and family-level cache/MMU features provide a familiar architecture for embedded software and protocol stacks.

This part is well suited for designers seeking a surface-mount, RoHS‑compliant solution with built-in communications peripherals and 3.3 V I/O. It delivers a balance of integration and deterministic 32‑bit processing for consumer-grade networking and embedded applications.

Request a quote or submit a product inquiry to receive pricing, availability and technical assistance for MPC857TVR100B.

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