MPC857TVR50B

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 1,651 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC857
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC857TVR50B – IC MPU MPC8XX 50MHZ 357BGA

The MPC857TVR50B is a single‑core, 32‑bit microprocessor in the MPC8xx family designed for embedded controller and communications applications. It integrates an MPC8xx core running at 50 MHz with on‑chip peripheral functionality suitable for networking and controller system designs.

Built as a surface‑mount PBGA device with 3.3 V I/O and a broad set of communications interfaces, the MPC857TVR50B targets embedded and consumer applications that require integrated communications peripheral support and proven PowerQUICC™ family hardware characteristics.

Key Features

  • Processor Core The MPC8xx family single‑issue 32‑bit core, implemented here as a single core running at 50 MHz.
  • Memory and MMU (family features) Family documentation describes configurable instruction and data caches and MMU support with TLB entries and multiple page sizes, providing the basis for memory management and caching (refer to family datasheet for details).
  • Communications Co‑processing Includes communications co‑processors and a Communications Processor Module (CPM) to offload protocol handling and peripheral communication tasks.
  • Networking Interfaces Integrated Ethernet support with one 10 Mbps port and one 10/100 Mbps port for wired network connectivity.
  • Peripheral Interfaces Additional serial interfaces include HDLC/SDLC support for protocol framing and synchronous communication links.
  • Memory Controller On‑chip DRAM controller support for system memory integration.
  • Power and I/O 3.3 V I/O voltage for compatibility with common embedded system logic levels.
  • Package and Mounting 357‑pin PBGA package (25 × 25 mm) / 357‑BBGA case, surface‑mount mounting for compact PCB integration.
  • Operating Range Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C.
  • Regulatory RoHS compliant.

Typical Applications

  • Embedded Controllers Use as a central processor in controller applications where integrated DRAM control and peripheral handling simplify board design.
  • Networking Equipment Platform for network devices and gateways leveraging on‑chip Ethernet ports and CPM communications offload.
  • Communications Systems Suitable for communications and protocol handling tasks that benefit from HDLC/SDLC interfaces and the Communications Processor Module.
  • Consumer Embedded Products Applicable to consumer‑grade embedded systems requiring a compact PBGA footprint and 3.3 V I/O compatibility.

Unique Advantages

  • Integrated Communications Peripherals: On‑chip CPM and communications co‑processors reduce external component count for protocol handling and link management.
  • Dual Ethernet Support: One 10 Mbps and one 10/100 Mbps Ethernet interface enable flexible wired networking configurations without separate PHY‑only solutions.
  • Compact PBGA Package: 357‑pin PBGA (25 × 25 mm) surface‑mount package balances high pin count with a compact PCB footprint.
  • 3.3 V I/O Compatibility: Standard 3.3 V I/O simplifies integration with common embedded peripherals and board power domains.
  • Documented PowerQUICC Family Heritage: Family hardware specifications and datasheet detail thermal, electrical, and interface characteristics to support system design and validation.
  • RoHS Compliant: Meets environmental compliance requirements for lead‑free manufacturing processes.

Why Choose MPC857TVR50B?

The MPC857TVR50B combines a single 32‑bit MPC8xx core running at 50 MHz with integrated communications peripherals and DRAM controller capability in a compact PBGA package. Its on‑chip CPM and Ethernet interfaces make it a practical choice for embedded and networking designs that require integrated protocol handling and wired connectivity while keeping board-level integration straightforward.

Backed by NXP Semiconductors and documented as part of the PowerQUICC family hardware specifications, the MPC857TVR50B is positioned for designers seeking a documented, RoHS‑compliant microprocessor solution for consumer and embedded communications applications.

Request a quote or submit your requirements today to get pricing and availability for the MPC857TVR50B.

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