MPC859DSLVR66A

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 159 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC859
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC859DSLVR66A – IC MPU MPC8XX 66MHz 357-PBGA

The MPC859DSLVR66A is a single-core, 32-bit microprocessor from the MPC859 family, implementing the MPC8xx core architecture. With a 66 MHz core clock and an integrated communications-oriented peripheral set, this device targets embedded controller and networking/communications applications where integration and predictable performance are important.

Designed for surface-mount deployment in a 357-pin PBGA (25 × 25 mm) package and qualified for consumer applications, the MPC859DSLVR66A combines a PowerPC-based core, cache and MMU support, on-chip communications coprocessor resources, and multiple I/O interfaces to simplify board-level design.

Key Features

  • Core — Single 32-bit MPC8xx core running at 66 MHz, implementing a PowerPC-based architecture suitable for embedded control and communications tasks.
  • Cache and MMU — On-chip caches (4 KB instruction / 4 KB data for the MPC859DSL variant) and MMUs with 32-entry fully associative TLBs to support efficient code and data handling.
  • Communications Coprocessor (CPM) — Integrated communications-focused coprocessor resources for protocol handling and peripheral control.
  • Memory Controller — Integrated DRAM controller to interface with system memory subsystems.
  • Ethernet Interfaces — Integrated Ethernet connectivity including one 10 Mbps interface and one 10/100 Mbps interface for networked applications.
  • Peripheral Interfaces — Standard embedded interfaces including I2C for board-level control and sensor connectivity.
  • Power — 3.3 V I/O voltage for compatibility with common embedded peripherals and interfaces.
  • Package & Mounting — 357-pin PBGA (25 × 25 mm) package, surface-mount mounting type for compact board layouts; package case listed as 357-BBGA.
  • Operating Range — Rated for an operating temperature range of 0 °C to 95 °C.
  • Environmental — RoHS compliant.

Typical Applications

  • Embedded Controllers — General-purpose embedded control where a single 32-bit core with MMU and cache is required for task handling and system management.
  • Communications & Networking Equipment — Devices that require integrated Ethernet interfaces and communications coprocessor resources for protocol processing and connectivity.
  • Consumer Electronics — Consumer-grade products that benefit from integrated peripherals, a compact PBGA package, and RoHS compliance.
  • Industrial Controllers — Control systems and instrumentation that use DRAM-backed memory subsystems and standard interfaces such as I2C.

Unique Advantages

  • Integrated Communications Resources: On-chip CPM and communications-focused coprocessor support reduce external component count for protocol handling and peripheral control.
  • Balanced CPU and Memory Subsystem: Cache and MMU support (4 KB instruction / 4 KB data caches and 32-entry TLBs) deliver efficient code execution and virtual memory capabilities for embedded operating environments.
  • Flexible Network Connectivity: Built-in Ethernet interfaces (one 10 Mbps and one 10/100 Mbps) simplify design of networked products without adding external PHYs for basic connectivity needs.
  • Compact, Surface-Mount PBGA Package: 357-pin PBGA (25 × 25 mm) enables high-density board layouts while providing the pin count needed for integrated peripherals and memory interfaces.
  • Industry-Standard I/O Voltage: 3.3 V I/O compatibility eases integration with common embedded peripherals and logic families.
  • RoHS Compliant: Meets RoHS requirements for use in lead-free manufacturing environments.

Why Choose MPC859DSLVR66A?

The MPC859DSLVR66A positions itself as an integrated embedded microprocessor solution combining a PowerPC-based MPC8xx core, communications coprocessor resources, memory controller support, and multiple network and peripheral interfaces. Its 66 MHz operating speed, on-chip caches and MMU features support efficient embedded software stacks, while the PBGA package and surface-mount form factor support compact board designs.

This part is suited for designers of consumer and embedded networking products who require an integrated communications-capable processor with standard 3.3 V I/O, Ethernet connectivity options, and RoHS compliance. The combination of integration and established MPC8xx family features helps simplify BOM and system design for medium-complexity embedded applications.

Request a quote or submit a product inquiry to obtain pricing, availability, and additional procurement details for the MPC859DSLVR66A.

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