MPC859TVR133A-NXP

The MPC859TVR133A-NXP is a single-core, 32-bit microprocessor from NXP Semiconductors based on the MPC8xx architecture. It operates at 133 MHz and integrates communications-focused co-processing, memory controller support, and Ethernet connectivity for embedded consumer applications.

Designed for embedded systems, this device targets consumer-grade applications that require integrated communication interfaces, DRAM controller support, and a compact surface-mount PBGA footprint, with 3.3 V I/O and an operating range of 0°C to 95°C.

Key Features

• Core & Performance Single MPC8xx core, 32-bit, running at 133 MHz for deterministic embedded processing.
• Memory & Controllers Integrated DRAM controller support to interface with external memory for system-level designs.
• Communications Co-Processing On-chip communications co-processor (CPM) and DSP capabilities focused on communications tasks.
• Ethernet & Serial Protocols Built-in Ethernet support with one 10 Mbps and one 10/100 Mbps interface, plus HDLC/SDLC protocol interfaces for networked embedded devices.
• Power & I/O 3.3 V I/O voltage for compatibility with common embedded peripherals and interfaces.
• Package & Mounting Supplied in a 357-PBGA (25×25) surface-mount package suitable for compact board layouts.
• Operating Range & Qualification Consumer-qualified device with an operating temperature range of 0°C to 95°C and RoHS compliance.

Typical Applications

• Consumer Embedded Systems — Acts as the main processing element in consumer devices requiring 32-bit control and memory interfacing within the 0°C to 95°C operating range.
• Networked Devices — Suitable for consumer networking equipment that uses integrated Ethernet ports and HDLC/SDLC interfaces for packet and protocol handling.
• Communications Offload — Leverages the CPM and communications DSP capabilities to manage protocol tasks and free the main core for application processing.
• DRAM-Based Controllers — Systems that require an on-chip DRAM controller for external memory expansion and buffering.

Unique Advantages

• Integrated Communications Subsystem: Communications-focused co-processor (CPM) and DSP support reduce the need for additional external communication ICs.
• Dual Ethernet Interfaces: Provides one 10 Mbps and one 10/100 Mbps Ethernet port for flexible networking configurations.
• Compact PBGA Package: 357-PBGA (25×25) surface-mount package supports compact board designs while maintaining necessary signal density.
• 3.3 V I/O Compatibility: Standard 3.3 V I/O simplifies interfacing with a wide range of embedded peripherals.
• Consumer Qualification and RoHS Compliance: Suited for consumer markets and compliant with RoHS requirements for environmental compliance.
• Wide Operating Range: Rated for operation from 0°C to 95°C to accommodate typical consumer operating environments.

Why Choose MPC859TVR133A-NXP?

The MPC859TVR133A-NXP combines a 32-bit MPC8xx core running at 133 MHz with integrated communications co-processing, DRAM controller support, and dual Ethernet interfaces—providing a balanced platform for consumer-oriented embedded designs that require onboard networking and protocol handling. Its 357-PBGA (25×25) surface-mount package and 3.3 V I/O make it suitable for compact, interface-rich systems.

For designers targeting consumer embedded applications that need integrated communications features and memory interface capability within a defined operating range, the MPC859TVR133A-NXP offers a focused feature set and RoHS compliance to support production deployment.

Request a quote or submit an inquiry today to obtain pricing and availability for the MPC859TVR133A-NXP.