MPC860DECZQ50D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 403 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860DECZQ50D4 – IC MPU MPC8XX 50MHz 357BGA
The MPC860DECZQ50D4 is a single-core 32-bit microprocessor in the MPC860 PowerQUICC family, featuring a 50 MHz MPC8xx core and integrated communications peripherals. Designed for controller applications, it is suited to communications and networking systems where integrated I/O, memory control and industrial-temperature operation are required.
Built on Power Architecture technology, the device combines a 32-bit CPU core with an enhanced communications processor module (CPM), DRAM controller capability and on-chip interfaces to streamline embedded system designs.
Key Features
- Core Single 32-bit MPC8xx core running at 50 MHz, providing deterministic processing for embedded control and communications tasks.
- Communications/CPM Includes a Communications Processor Module (CPM) for handling communications functions; CPM features and channels support serial and network-centric I/O.
- Memory Integrated DRAM controller to support external memory configurations required by embedded applications.
- Ethernet On-chip Ethernet capability supporting two 10 Mbps interfaces for network connectivity and data exchange.
- Interfaces Additional interfaces include I2C and a PCMCIA socket controller capability referenced in the family documentation for peripheral expansion.
- Package & Mounting 357-pin PBGA package (25 × 25 mm) in a surface-mount form factor to support compact board designs.
- Operating Conditions Industrial-grade operating temperature range from −40 °C to 95 °C and 3.3 V I/O compatibility for industrial environments.
- Compliance RoHS compliant.
Typical Applications
- Communications Equipment Use as the central controller in routers, gateways or protocol converters where integrated communications processing and Ethernet are required.
- Networking Systems Ideal for embedded network appliances and control planes that need a combination of CPU processing and CPM-managed serial/network interfaces.
- Industrial Controllers Suitable for industrial automation and control platforms that demand industrial temperature operation and 3.3 V I/O compatibility.
- Embedded Controller Platforms Serves in single-chip controller roles where DRAM support and peripheral I/O (I2C, PCMCIA support noted in family documentation) simplify system architecture.
Unique Advantages
- Integrated Communications Subsystem: The CPM offloads communications processing from the CPU, reducing software overhead for protocol handling and serial I/O.
- Power Architecture Core: A 32-bit MPC8xx core delivers predictable embedded performance at 50 MHz for control and networking tasks.
- DRAM Support: On-chip memory controller support enables flexible external memory choices to match application requirements.
- Industrial Temperature Range: Rated for −40 °C to 95 °C operation, enabling deployment in harsh environments.
- Compact PBGA Package: 357-PBGA (25 × 25 mm) surface-mount package balances I/O density and board space for embedded designs.
- Standards and Compliance: RoHS compliance supports regulatory requirements for modern product development.
Why Choose MPC860DECZQ50D4?
The MPC860DECZQ50D4 positions itself as a practical choice for embedded communications and control designs that require a single 32-bit core, integrated communications processing, and support for external DRAM. Its industrial temperature rating and 3.3 V I/O make it suitable for long-lived deployments in industrial and networking equipment.
Backed by the MPC860 family documentation and NXP Semiconductor heritage, the device provides a documented hardware platform for designers seeking a compact, integrated microprocessor solution with on-chip communications capabilities.
Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the MPC860DECZQ50D4.

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