MPC860DECZQ50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 403 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860DECZQ50D4 – IC MPU MPC8XX 50MHz 357BGA

The MPC860DECZQ50D4 is a single-core 32-bit microprocessor in the MPC860 PowerQUICC family, featuring a 50 MHz MPC8xx core and integrated communications peripherals. Designed for controller applications, it is suited to communications and networking systems where integrated I/O, memory control and industrial-temperature operation are required.

Built on Power Architecture technology, the device combines a 32-bit CPU core with an enhanced communications processor module (CPM), DRAM controller capability and on-chip interfaces to streamline embedded system designs.

Key Features

  • Core  Single 32-bit MPC8xx core running at 50 MHz, providing deterministic processing for embedded control and communications tasks.
  • Communications/CPM  Includes a Communications Processor Module (CPM) for handling communications functions; CPM features and channels support serial and network-centric I/O.
  • Memory  Integrated DRAM controller to support external memory configurations required by embedded applications.
  • Ethernet  On-chip Ethernet capability supporting two 10 Mbps interfaces for network connectivity and data exchange.
  • Interfaces  Additional interfaces include I2C and a PCMCIA socket controller capability referenced in the family documentation for peripheral expansion.
  • Package & Mounting  357-pin PBGA package (25 × 25 mm) in a surface-mount form factor to support compact board designs.
  • Operating Conditions  Industrial-grade operating temperature range from −40 °C to 95 °C and 3.3 V I/O compatibility for industrial environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Communications Equipment  Use as the central controller in routers, gateways or protocol converters where integrated communications processing and Ethernet are required.
  • Networking Systems  Ideal for embedded network appliances and control planes that need a combination of CPU processing and CPM-managed serial/network interfaces.
  • Industrial Controllers  Suitable for industrial automation and control platforms that demand industrial temperature operation and 3.3 V I/O compatibility.
  • Embedded Controller Platforms  Serves in single-chip controller roles where DRAM support and peripheral I/O (I2C, PCMCIA support noted in family documentation) simplify system architecture.

Unique Advantages

  • Integrated Communications Subsystem: The CPM offloads communications processing from the CPU, reducing software overhead for protocol handling and serial I/O.
  • Power Architecture Core: A 32-bit MPC8xx core delivers predictable embedded performance at 50 MHz for control and networking tasks.
  • DRAM Support: On-chip memory controller support enables flexible external memory choices to match application requirements.
  • Industrial Temperature Range: Rated for −40 °C to 95 °C operation, enabling deployment in harsh environments.
  • Compact PBGA Package: 357-PBGA (25 × 25 mm) surface-mount package balances I/O density and board space for embedded designs.
  • Standards and Compliance: RoHS compliance supports regulatory requirements for modern product development.

Why Choose MPC860DECZQ50D4?

The MPC860DECZQ50D4 positions itself as a practical choice for embedded communications and control designs that require a single 32-bit core, integrated communications processing, and support for external DRAM. Its industrial temperature rating and 3.3 V I/O make it suitable for long-lived deployments in industrial and networking equipment.

Backed by the MPC860 family documentation and NXP Semiconductor heritage, the device provides a documented hardware platform for designers seeking a compact, integrated microprocessor solution with on-chip communications capabilities.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the MPC860DECZQ50D4.

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