MPC860DEZQ50D4R2
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,715 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860DEZQ50D4R2 – IC MPU MPC8XX 50MHZ 357BGA
The MPC860DEZQ50D4R2 is a single‑core, 32‑bit microprocessor in the MPC860 PowerQUICC family, manufactured by NXP Semiconductors. Built on Power Architecture technology with integrated communication peripherals, this device targets embedded communications and networking applications where a compact, integrated controller is required.
With a 50 MHz CPU, on‑chip communications processor module (CPM), enhanced memory controller for DRAM, and dual Ethernet interfaces, the device delivers an integrated platform for controller and communications designs while operating at 3.3 V I/O and a consumer temperature range of 0 °C to 95 °C.
Key Features
- Core and Architecture Single 32‑bit core built on Power Architecture technology with memory management units (MMUs) and instruction and data caches for efficient program execution.
- Processor Speed 50 MHz CPU frequency suitable for embedded control and communications tasks.
- Communications Processor Module (CPM) Integrated CPM provides communication-focused co‑processing, with an enhanced I2C channel for serial control and peripheral interfacing.
- Ethernet Connectivity Dual Ethernet interfaces (10 Mbps × 2) for networked embedded applications.
- Memory Support Enhanced memory controller supporting DRAM types to accommodate external system memory needs.
- Peripheral Integration On‑chip controllers include a PCMCIA socket controller (supports up to two sockets) and a real‑time clock as part of the on‑chip peripheral set.
- Power and I/O 3.3 V I/O voltage compatibility for common embedded system levels.
- Package and Mounting 357‑ball PBGA (25 × 25 mm) surface‑mount package for compact board integration.
- Operating Range and Compliance Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
Typical Applications
- Networked Embedded Controllers — Integration of dual Ethernet interfaces and the CPM makes the part suitable for compact protocol controllers and small gateways.
- Communications Equipment — On‑chip communications processing and serial interfaces support communications-centric control functions.
- PCMCIA‑equipped Devices — Built‑in PCMCIA socket controller supports designs that require removable media or interface modules.
- General Embedded Systems — 32‑bit Power Architecture core and DRAM controller enable general purpose embedded control in consumer applications within the specified temperature and voltage ranges.
Unique Advantages
- Integrated Communications Subsystem: The onboard CPM and dual Ethernet interfaces reduce external component count and streamline networked design implementation.
- Memory Flexibility: Enhanced memory controller supports DRAM variants, enabling designers to choose appropriate external memory for application needs.
- Compact Package: 357‑PBGA (25×25) surface‑mount footprint delivers high integration in a space‑efficient package.
- Power‑Level Compatibility: 3.3 V I/O simplifies interfacing with common embedded logic and peripherals.
- Documented Architecture: Part of the MPC860 PowerQUICC family with supporting hardware specifications and user documentation for design reference.
- Regulatory and Environmental Compliance: RoHS compliance supports environmentally conscious product builds.
Why Choose MPC860DEZQ50D4R2?
The MPC860DEZQ50D4R2 positions itself as an integrated solution for embedded communication and control applications that require a Power Architecture 32‑bit core paired with a communications co‑processor and versatile memory support. Its on‑chip CPM, dual Ethernet interfaces, and PCMCIA support reduce system complexity and BOM for compact designs.
This device is well suited to designers of consumer‑grade networked and embedded products who need clear documentation and a compact PBGA package with 3.3 V I/O and a 0 °C to 95 °C operating range. As part of the MPC860 PowerQUICC family, it is backed by family hardware specifications and user manuals for design and integration guidance.
Request a quote or submit a procurement inquiry to receive pricing, availability, and delivery details for the MPC860DEZQ50D4R2.

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