MPC860DEZQ50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 698 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860DEZQ50D4 – IC MPU MPC8XX 50 MHz 357‑PBGA

The MPC860DEZQ50D4 is a single‑core 32‑bit microprocessor in the MPC8xx family, implementing Power Architecture technology and integrating a range of controller and communications peripherals on a single chip. It is designed for embedded controller applications and communications/networking systems where integrated peripheral functionality and compact packaging are important.

This device combines a 50 MHz MPC8xx core with an enhanced communications processor module (CPM), DRAM memory controller, I2C channel, PCMCIA socket controller capability, and dual Ethernet interfaces, delivering a tightly integrated solution for embedded networking and controller designs.

Key Features

  • Core – 32‑bit MPC8xx core running at 50 MHz, with integrated memory management units (MMUs) and instruction/data caches as described in the device documentation.
  • Communications Processor (CPM) – On‑chip communications co‑processor (CPM) to handle communications and protocol offload tasks for networking applications.
  • Memory and DRAM Controller – Enhanced memory controller supporting DRAM types and system memory configurations for embedded applications.
  • Ethernet Interfaces – Two 10 Mbps Ethernet interfaces for wired network connectivity and communications tasks.
  • Peripheral Interfaces – I2C channel plus a PCMCIA socket controller capability supporting up to two sockets, enabling flexible peripheral and expansion options.
  • Package and Mounting – 357‑pin PBGA (25×25 mm) surface‑mount package (357‑BBGA case), suitable for compact board layouts.
  • Power and I/O – 3.3 V I/O signaling.
  • Operating Range – Specified operating temperature range from 0 °C to 95 °C.
  • Environmental – RoHS compliant.

Typical Applications

  • Communications & Networking Equipment – Use the integrated CPM and dual Ethernet interfaces for packet handling, protocol processing, and small network node designs.
  • Embedded Controller Systems – Single‑chip integration of CPU, DRAM controller, I2C, and PCMCIA support makes it suitable for compact embedded controllers requiring on‑board expansion.
  • PCMCIA‑Enabled Devices – Built‑in PCMCIA socket controller support allows straightforward implementation of PCMCIA peripheral interfaces and removable expansion.

Unique Advantages

  • Highly integrated architecture: One‑chip microprocessor plus communications and peripheral functions reduce BOM and simplify system design.
  • Purposeful communications support: The included CPM and dual 10 Mbps Ethernet interfaces provide hardware resources tailored to networking tasks.
  • Flexible memory support: Enhanced DRAM controller enables use of a variety of DRAM types for system memory configurations.
  • Compact PBGA package: 357‑pin PBGA (25×25 mm) surface‑mount package supports dense board layouts while preserving I/O count.
  • Documented architecture: Power Architecture CPU with MMU and caches and integrated peripherals are described in the available device documentation to aid system development.
  • Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose MPC860DEZQ50D4?

The MPC860DEZQ50D4 positions itself as a compact, integrated microprocessor solution for embedded communications and controller applications. With a Power Architecture‑based 32‑bit core, on‑chip CPM, DRAM controller, I2C and PCMCIA support, plus dual Ethernet interfaces, it is aimed at designs that require consolidated functionality in a single package operating from 3.3 V I/O and rated for 0 °C to 95 °C operation.

Engineers and procurement teams seeking a consumer‑grade embedded processor with documented architecture and integrated communications peripherals will find the MPC860DEZQ50D4 delivers a clear, verifiable feature set to support networking and controller designs while meeting RoHS environmental requirements.

Request a quote or submit an inquiry for availability and pricing of the MPC860DEZQ50D4 to evaluate it for your next embedded communications or controller project.

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