MPC860DEZQ50D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 698 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860DEZQ50D4 – IC MPU MPC8XX 50 MHz 357‑PBGA
The MPC860DEZQ50D4 is a single‑core 32‑bit microprocessor in the MPC8xx family, implementing Power Architecture technology and integrating a range of controller and communications peripherals on a single chip. It is designed for embedded controller applications and communications/networking systems where integrated peripheral functionality and compact packaging are important.
This device combines a 50 MHz MPC8xx core with an enhanced communications processor module (CPM), DRAM memory controller, I2C channel, PCMCIA socket controller capability, and dual Ethernet interfaces, delivering a tightly integrated solution for embedded networking and controller designs.
Key Features
- Core – 32‑bit MPC8xx core running at 50 MHz, with integrated memory management units (MMUs) and instruction/data caches as described in the device documentation.
- Communications Processor (CPM) – On‑chip communications co‑processor (CPM) to handle communications and protocol offload tasks for networking applications.
- Memory and DRAM Controller – Enhanced memory controller supporting DRAM types and system memory configurations for embedded applications.
- Ethernet Interfaces – Two 10 Mbps Ethernet interfaces for wired network connectivity and communications tasks.
- Peripheral Interfaces – I2C channel plus a PCMCIA socket controller capability supporting up to two sockets, enabling flexible peripheral and expansion options.
- Package and Mounting – 357‑pin PBGA (25×25 mm) surface‑mount package (357‑BBGA case), suitable for compact board layouts.
- Power and I/O – 3.3 V I/O signaling.
- Operating Range – Specified operating temperature range from 0 °C to 95 °C.
- Environmental – RoHS compliant.
Typical Applications
- Communications & Networking Equipment – Use the integrated CPM and dual Ethernet interfaces for packet handling, protocol processing, and small network node designs.
- Embedded Controller Systems – Single‑chip integration of CPU, DRAM controller, I2C, and PCMCIA support makes it suitable for compact embedded controllers requiring on‑board expansion.
- PCMCIA‑Enabled Devices – Built‑in PCMCIA socket controller support allows straightforward implementation of PCMCIA peripheral interfaces and removable expansion.
Unique Advantages
- Highly integrated architecture: One‑chip microprocessor plus communications and peripheral functions reduce BOM and simplify system design.
- Purposeful communications support: The included CPM and dual 10 Mbps Ethernet interfaces provide hardware resources tailored to networking tasks.
- Flexible memory support: Enhanced DRAM controller enables use of a variety of DRAM types for system memory configurations.
- Compact PBGA package: 357‑pin PBGA (25×25 mm) surface‑mount package supports dense board layouts while preserving I/O count.
- Documented architecture: Power Architecture CPU with MMU and caches and integrated peripherals are described in the available device documentation to aid system development.
- Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.
Why Choose MPC860DEZQ50D4?
The MPC860DEZQ50D4 positions itself as a compact, integrated microprocessor solution for embedded communications and controller applications. With a Power Architecture‑based 32‑bit core, on‑chip CPM, DRAM controller, I2C and PCMCIA support, plus dual Ethernet interfaces, it is aimed at designs that require consolidated functionality in a single package operating from 3.3 V I/O and rated for 0 °C to 95 °C operation.
Engineers and procurement teams seeking a consumer‑grade embedded processor with documented architecture and integrated communications peripherals will find the MPC860DEZQ50D4 delivers a clear, verifiable feature set to support networking and controller designs while meeting RoHS environmental requirements.
Request a quote or submit an inquiry for availability and pricing of the MPC860DEZQ50D4 to evaluate it for your next embedded communications or controller project.

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