MPC860DPVR80D4

IC MPU 80MHZ 357BGA
Part Description

Microprocessor IC * 357-PBGA (25x25)

Quantity 1,025 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0 °C – 95 °CPackage / Case357-BBGAQualificationConsumer
RAM ControllersDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed80 MHz

Overview of MPC860DPVR80D4 – IC MPU 80MHZ 357BGA

The MPC860DPVR80D4 is a surface-mount microprocessor from NXP Semiconductors' MPC860 series. It implements a 32-bit MPC8xx core running at 80 MHz and integrates communication-oriented peripherals to support embedded controller and networking applications.

Designed for consumer-class embedded systems, the device combines a Power Architecture™–based CPU with on-chip memory and communication controllers to simplify system design for applications requiring DRAM support, communications co-processing and real-time functions.

Key Features

  • 32‑Bit Core (MPC8xx) Single 32‑bit core providing Power Architecture™ technology as described for the MPC860 family, with integrated MMU and instruction/data caches.
  • Clock Speed Operates at 80 MHz to meet the timing needs of a range of embedded control and communications tasks.
  • Communications Co‑processor (CPM) Integrated Communications Processor Module (CPM) for handling communications tasks; CPM functionality in the MPC860 family includes enhanced channels such as I2C.
  • Memory Support On‑chip memory controller with DRAM support; the MPC860 family memory controller is described as supporting multiple DRAM types.
  • Integrated System Peripherals Series documentation indicates support for features such as a PCMCIA socket controller (up to two sockets) and a real‑time clock, enabling richer peripheral integration.
  • Package and Mounting 357‑PBGA package (25×25 mm) in a 357‑BBGA case, intended for surface‑mount assembly.
  • Operating Range Rated for 0 °C to 95 °C operation, suitable for consumer‑class embedded environments.
  • Environmental Compliance RoHS‑compliant for environmental and manufacturing compatibility.

Typical Applications

  • Embedded Communications Equipment Use the integrated CPM and Power Architecture core for protocol handling and packet processing in networking and communications controllers.
  • Networked Consumer Devices Suitable for consumer‑class products that require DRAM memory support and integrated controller functions.
  • PCMCIA‑Equipped Systems Systems that require PCMCIA expansion can leverage the MPC860 family’s on‑chip PCMCIA socket controller support.
  • Real‑Time Control Integrated real‑time clock and on‑chip controllers make the device applicable to embedded control tasks with timekeeping needs.

Unique Advantages

  • Integrated Communications Subsystem: The on‑chip CPM reduces external component count for communication interfaces and offloads protocol tasks from the main CPU.
  • Memory Flexibility: The MPC860 family memory controller supports a range of DRAM types, simplifying memory selection and enabling higher system memory performance where needed.
  • System Integration: Built‑in peripherals such as PCMCIA support and a real‑time clock consolidate system functions onto a single device, lowering BOM and simplifying layout.
  • Compact Surface‑Mount Package: The 357‑PBGA (25×25) package provides a compact footprint suitable for densely packed PCBs.
  • Regulatory and Manufacturing Readiness: RoHS compliance facilitates manufacturing and regulatory alignment for consumer electronics production.

Why Choose MPC860DPVR80D4?

The MPC860DPVR80D4 positions itself as a practical, integrated microprocessor solution for consumer‑class embedded and communications designs. With a 32‑bit Power Architecture core, integrated CPM communications support, DRAM controller capabilities, and on‑chip peripherals, it streamlines system design where communications and memory flexibility are priorities.

Engineers and procurement teams seeking a RoHS‑compliant, surface‑mount microprocessor in a 357‑PBGA package will find the MPC860DPVR80D4 suitable for designs that balance integration, communications capability, and a defined operating temperature range.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead‑time information for the MPC860DPVR80D4.

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