MPC860DPZQ50D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,256 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (2), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860DPZQ50D4 – IC MPU MPC8XX 50MHZ 357BGA
The MPC860DPZQ50D4 is a PowerQUICC integrated microprocessor from NXP Semiconductors based on the MPC8xx core architecture. It combines a 32‑bit single core CPU running at 50 MHz with an integrated Communications Processor Module (CPM) and a suite of peripheral controllers tailored for communications and controller applications.
This device is well suited for embedded and networking-oriented systems that require on‑chip communications interfaces, DRAM memory control and multiple Ethernet ports in a compact 357‑PBGA (25×25) surface‑mount package.
Key Features
- Core and Performance
Single 32‑bit MPC8xx core operating at 50 MHz, built on Power Architecture technology with instruction and data caches and memory management support as documented for the MPC860 family. - Integrated Communications Processor (CPM)
On‑chip CPM co‑processor for communications handling and protocol offload, including HDLC/SDLC support. - Ethernet Connectivity
Multiple integrated Ethernet interfaces: two 10 Mbps ports and one 10/100 Mbps port to support a range of network topologies and speeds. - Memory and Bus
Includes DRAM controller support for system memory integration and standard bus interfaces for embedded designs. - I/O and Voltage
3.3 V I/O signaling for compatibility with common embedded peripherals and logic families. - Package and Mounting
357‑PBGA (25×25) package, surface‑mount for compact board layouts and high‑density designs. - Operating Range
Rated for operation from 0 °C to 95 °C to meet a variety of commercial embedded environment requirements. - Compliance
RoHS compliant for environmental and manufacturing compliance needs.
Typical Applications
- Communications and Networking Equipment
Integrated Ethernet ports and CPM support make this device suitable for routers, gateways and protocol‑centric network appliances. - Embedded Controller Systems
Single‑chip integration of CPU, memory controller and communications interfaces supports compact controller designs for embedded applications. - PCMCIA‑Enabled Devices
The MPC860 family documentation notes integrated PCMCIA socket controller support, useful for designs requiring removable media or legacy I/O expansion. - Protocol Offload and Telemetry
HDLC/SDLC and CPM resources enable offloading serial and framed protocol processing from the host CPU in communications appliances.
Unique Advantages
- Highly integrated communications functionality: On‑chip CPM and multiple Ethernet interfaces reduce external components and simplify BOM for networked embedded systems.
- Compact BGA footprint: 357‑PBGA (25×25) package supports high‑density PCB designs while enabling surface‑mount assembly.
- Proven architecture and documentation: Power Architecture‑based MPC8xx core with family hardware specifications and datasheet material to support design and validation activities.
- Flexible memory support: DRAM controller enables use of a variety of system memory options for scalable application requirements.
- Commercial temperature rating and RoHS compliance: 0 °C to 95 °C operating range and RoHS compliance for standard commercial embedded deployments.
Why Choose MPC860DPZQ50D4?
The MPC860DPZQ50D4 offers a balanced, integrated solution for communications‑focused embedded designs where on‑chip protocol handling, Ethernet connectivity and DRAM support are priorities. Its single 32‑bit MPC8xx core combined with the CPM and multiple Ethernet ports simplifies system architecture and reduces external component count.
This part is well suited to developers and procurement teams building compact, networked controllers and communications appliances that rely on documented PowerQUICC hardware specifications and require a commercially rated, RoHS‑compliant microprocessor solution from NXP Semiconductors.
Request a quote or submit an inquiry for pricing and availability to evaluate the MPC860DPZQ50D4 for your next embedded communications design.

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