MPC860DTCVR66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 1,025 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (2), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860DTCVR66D4 – IC MPU MPC8XX 66MHz 357BGA

The MPC860DTCVR66D4 is a single‑core 32‑bit microprocessor from NXP Semiconductors' MPC860 series, featuring a 66 MHz core and integrated communications peripherals. Designed as a one‑chip microprocessor and peripheral combination, it targets embedded controller applications with strong emphasis on communications and networking.

Key on‑chip capabilities include a Communications Processor Module (CPM), DRAM controller support and multi‑port Ethernet connectivity, all in a compact 357‑pin PBGA package and qualified for industrial temperature operation.

Key Features

  • Core  Single MPC8xx 32‑bit core running at 66 MHz, implementing Power Architecture technology for standard embedded processing tasks.
  • Communications Processor (CPM)  Integrated CPM for communications offload and protocol handling, with support for HDLC/SDLC interfaces.
  • Memory Support  On‑chip DRAM controller support enabling connection to a variety of DRAM types for system memory.
  • Ethernet Connectivity  Multiple Ethernet interfaces: two 10 Mbps ports and one 10/100 Mbps port to support diverse networking topologies.
  • Voltage and Mounting  3.3 V I/O voltage and surface‑mount PBGA package (357‑PBGA, 25×25 mm) for compact board designs.
  • Industrial Qualification & Temperature  Industrial qualification with operating temperature range of −40 °C to 95 °C for deployment in harsh environments.
  • Packaging  357‑pin PBGA (25×25) package providing high pin density for rich peripheral integration.
  • Standards & Compliance  RoHS compliant, supporting regulatory and environmental requirements.

Typical Applications

  • Communications Equipment  Suitable for routers, gateways and protocol converters where integrated CPM and multi‑port Ethernet accelerate packet handling and link management.
  • Industrial Controllers  Used in industrial control systems that require robust operation across −40 °C to 95 °C and support for field communication protocols via HDLC/SDLC.
  • Embedded Networking Devices  Ideal for embedded appliances that need a compact single‑chip solution combining CPU, memory controller and multiple Ethernet interfaces.

Unique Advantages

  • Integrated Communications Subsystem: Combines a 32‑bit CPU with a CPM communications co‑processor to offload protocol processing and simplify system architecture.
  • Multi‑port Ethernet Support: Provides two 10 Mbps ports plus one 10/100 Mbps port to support versatile network configurations without additional controllers.
  • Industrial Temperature Range: Qualified for −40 °C to 95 °C operation, enabling deployment in demanding environments.
  • Compact High‑Density Package: 357‑pin PBGA (25×25 mm) supports rich peripheral connectivity while minimizing PCB footprint.
  • Developer Documentation: Backed by NXP/Freescale MPC860 family hardware and user documentation to support design and system integration efforts.
  • Regulatory Compliance: RoHS compliant for environmentally conscious product designs.

Why Choose MPC860DTCVR66D4?

The MPC860DTCVR66D4 positions itself as a practical, integrated microprocessor solution for embedded communications and industrial controller designs. With a dedicated communications processor module, multi‑port Ethernet, DRAM controller support and industrial temperature qualification, it streamlines BOM and board complexity for networked embedded systems.

It is well suited to engineers and procurement teams building robust networking appliances, protocol gateways, and industrial controllers that require a compact, documented platform from a recognized semiconductor manufacturer.

If you would like pricing, availability or to submit a quote request for the MPC860DTCVR66D4, please request a quote or submit a quote through your preferred procurement channel.

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