MPC860DTVR50D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 452 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (2), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860DTVR50D4 – IC MPU MPC8XX 50MHZ 357BGA
The MPC860DTVR50D4 is a member of the MPC860 PowerQUICC family: a single-core, 32-bit microprocessor IC implementing Power Architecture technology for embedded communications and control applications. It integrates on-chip communications acceleration and peripheral controllers to support networking, protocol handling, and system control functions.
Key elements include a 50 MHz MPC8xx core, integrated communications co-processor (CPM), DRAM memory controller, multiple Ethernet interfaces, and a 357‑pin PBGA surface-mount package—designed for compact embedded systems that require integrated communications capability and straightforward hardware integration.
Key Features
- Core & Architecture Single 32-bit MPC8xx core running at 50 MHz with Power Architecture technology; the family documentation describes on-chip MMUs and instruction/data caches for system-level memory management and performance.
- Communications Co-Processor (CPM) Integrated CPM designed for communications and protocol offload; supports serial protocols and system communications acceleration.
- Ethernet Interfaces Multiple integrated Ethernet ports: two 10 Mbps interfaces and one 10/100 Mbps interface for diversified network connectivity.
- Memory & Controllers On-chip DRAM controller to interface with external DRAM; family documentation also references a PCMCIA socket controller supporting up to two sockets.
- Additional Interfaces HDLC/SDLC support and communications-oriented peripheral interfaces for protocol framing and serial link management.
- Power & I/O 3.3 V I/O signaling for common embedded system compatibility.
- Package & Mounting 357‑PBGA (25 × 25 mm) surface-mount package for space-efficient board designs.
- Operating Range & Qualification Consumer-grade qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.
Typical Applications
- Networking Equipment Embedded routers, switches, and network controllers that require multiple Ethernet interfaces and protocol handling.
- Communications Gateways Protocol conversion and link-management appliances leveraging the CPM and HDLC/SDLC interfaces for serial and framed links.
- Embedded Controllers Compact controller systems using the on-chip DRAM controller and integrated peripherals for control and I/O tasks.
Unique Advantages
- Integrated Communications Subsystem: The on-chip CPM and HDLC/SDLC interfaces reduce external peripheral requirements for protocol handling and serial communications.
- Multi-Port Ethernet: Two 10 Mbps ports plus a 10/100 Mbps port provide flexible LAN/WAN connectivity options without added PHY complexity.
- Compact, Surface-Mount Package: 357‑PBGA (25×25) packaging enables high-density board layouts while supporting the device’s I/O requirements.
- Standard 3.3 V I/O: Compatibility with common 3.3 V system designs simplifies integration with modern embedded components.
- Family-Level Ecosystem: As part of the MPC860 PowerQUICC family, the device benefits from documented architecture features such as MMUs, caches, and expanded peripheral support detailed in the family datasheet.
Why Choose MPC860DTVR50D4?
The MPC860DTVR50D4 is positioned for embedded designs that prioritize integrated communications capability and compact system integration. Its 32-bit MPC8xx core combined with the CPM, multi-port Ethernet, and DRAM controller delivers a balanced solution for networking and communications-oriented embedded applications.
This device is suitable for designers and procurement teams seeking a RoHS-compliant, surface-mount microprocessor with established family documentation and on-chip peripherals that reduce BOM complexity and streamline board-level design.
Request a quote or submit a quote to receive pricing and availability for the MPC860DTVR50D4. Our team will provide the necessary details to move your design forward.

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