MPC860ENCZQ50D4

The MPC860ENCZQ50D4 is a single‑core 32‑bit microprocessor in the MPC860 PowerQUICC family from NXP Semiconductors. It implements Power Architecture™ technology with integrated communications functionality, making it suitable for controller and communications-oriented embedded designs.

Key attributes include a 50 MHz core, integrated communications co‑processing via the CPM, DRAM memory controller support, multiple Ethernet interfaces, 3.3 V I/O and an industrial operating temperature range, delivering a compact, rugged platform for networking and industrial embedded applications.

Key Features

• Core and Architecture  The MPC860 family Power Architecture™ 32‑bit core with MMU and instruction/data caches provides a standard embedded processing foundation.
• Performance  50 MHz core frequency, single 32‑bit core suitable for deterministic controller and communications tasks.
• Communications Co‑processing  Integrated Communications Processor Module (CPM) and communications DSP resources for protocol handling and I/O management.
• Memory Support  On‑chip DRAM controller enabling connection to a range of DRAM types for system memory.
• Ethernet Interfaces  Supports 10 Mbps Ethernet connectivity (listed as 10Mbps (4)).
• I/O Voltage and Interfaces  3.3 V I/O and additional interfaces including I2C for peripheral management.
• Package and Mounting  357‑pin PBGA package (25 × 25 mm) in a surface‑mount form factor for compact board designs.
• Industrial Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 95 °C for deployment in demanding environments.
• RoHS Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Networking Equipment  Hardware that requires integrated communications handling and multiple Ethernet interfaces for packet processing and control.
• Industrial Control  Embedded controllers and automation nodes benefiting from industrial temperature rating and DRAM memory support.
• Communications Systems  Systems that leverage the CPM and communications co‑processor resources for protocol offload and I/O timing.
• Embedded Devices with PCMCIA Support  Designs that require on‑board PCMCIA socket controller functionality as provided across the MPC860 family.

Unique Advantages

• Integrated Communications Subsystem  On‑chip CPM and communications DSP resources reduce external components and simplify protocol handling.
• Industrial‑Grade Operation  −40 °C to 95 °C operating range supports reliable operation in harsh field environments.
• Compact, Surface‑Mount BGA  357‑pin PBGA (25×25 mm) package enables a high‑density layout and compact board footprint.
• 3.3 V I/O Compatibility  Standard 3.3 V I/O simplifies interfacing with common peripheral logic levels.
• Multiple Ethernet Interfaces  Built‑in 10 Mbps Ethernet ports provide native connectivity options for networked applications.
• RoHS Compliant  Meets RoHS requirements for regulated markets and environmental compliance.

Why Choose MPC860ENCZQ50D4?

The MPC860ENCZQ50D4 combines a Power Architecture™ 32‑bit core with integrated communications processors and DRAM controller support to deliver a compact, capable platform for embedded networking and controller applications. Its industrial qualification and broad interface set make it well suited to designs that require dependable operation across temperature extremes and native Ethernet connectivity.

This part is ideal for engineers designing communications‑centric embedded systems and industrial controllers who need an integrated solution from a recognized manufacturer, with the device family documentation and hardware specifications available from the vendor for design and validation.

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