MPC860ENCVR50D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,376 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (4) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860ENCVR50D4 – IC MPU MPC8XX 50MHZ 357BGA
The MPC860ENCVR50D4 is a single‑core, 32‑bit microprocessor from NXP Semiconductors based on the MPC8xx Power Architecture technology. It operates at 50 MHz and integrates processor, communications and memory control functionality targeted at communications, networking and embedded controller applications.
Designed for industrial environments, the device features 3.3 V I/O, a compact 357‑PBGA (25×25) surface‑mount package and an extended operating range of -40 °C to 95 °C, providing a robust platform for embedded systems that require integrated communications and memory support.
Key Features
- Core & Architecture 32‑bit MPC8xx core running at 50 MHz; datasheet documents memory management units (MMUs) and instruction and data caches for standard Power Architecture operation.
- Communications Coprocessor (CPM) Integrated communications processor module (CPM) and communications DSP functionality to support network and serial communications tasks; includes an I2C channel.
- Memory & DRAM Controller Enhanced memory controller with DRAM support; datasheet describes support for multiple memory types including newer high‑performance DRAMs.
- Ethernet & Interfaces Ethernet capability listed as 10 Mbps (4) and additional interfaces including I2C; PCMCIA socket controller support is documented in the family specification.
- Power and I/O 3.3 V I/O voltage for common embedded system interfacing.
- Package & Mounting 357‑PBGA package (25×25), 357‑BBGA case; surface mount device suitable for compact board designs.
- Industrial Qualification & Temperature Range Qualified for industrial use with an operating temperature range of -40 °C to 95 °C.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Communications & Networking Equipment Suited for embedded communications controllers and networking subsystems where integrated CPM functionality and Ethernet support are required.
- Industrial Control Systems Industrial qualification and extended temperature range make it appropriate for controllers and automation equipment operating in harsh environments.
- Embedded Controller Platforms Single‑core 32‑bit Power Architecture core with MMU and caches provides a foundation for real‑time control and general embedded processing tasks.
- PCMCIA Host Devices and Legacy Expansion Family documentation includes PCMCIA socket controller support for designs that require up to two PCMCIA sockets.
Unique Advantages
- Integrated Communications Subsystem: On‑chip CPM and communications DSP capability reduce external component count for networking features.
- Power Architecture Core with MMU and Caches: Processor design includes MMUs and instruction/data caches for structured memory management and efficient code execution.
- Flexible Memory Support: Enhanced memory controller supports DRAM and various memory types, simplifying memory subsystem design.
- Industrial‑Grade Operation: -40 °C to 95 °C operating range and industrial qualification support deployment in demanding environments.
- Compact Surface‑Mount Package: 357‑PBGA (25×25) package enables dense board layouts while providing the required pinout for integrated peripherals.
- Standards‑Friendly I/O: 3.3 V I/O and documented interfaces like I2C and Ethernet facilitate integration with common peripherals and network links.
Why Choose MPC860ENCVR50D4?
The MPC860ENCVR50D4 positions itself as an integrated microprocessor solution for embedded communications and control applications, combining a 32‑bit Power Architecture core, on‑chip communications modules and flexible memory support. Its industrial qualification, extended temperature range and RoHS compliance make it suitable for long‑life embedded systems and industrial deployments.
Engineers selecting this part gain a compact, surface‑mount package with documented memory and communications subsystems backed by NXP Semiconductors’ product documentation—providing a practical platform for designs that require integrated networking features and reliable industrial operation.
Request a quote or submit a procurement inquiry to evaluate the MPC860ENCVR50D4 for your next embedded communications or industrial control design.

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