MPC860DTVR66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 1,798 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (2), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860DTVR66D4 – IC MPU MPC8XX 66MHZ 357BGA

The MPC860DTVR66D4 is a single‑core 32‑bit microprocessor from NXP Semiconductors’ MPC860 PowerQUICC family. It implements the MPC8xx core built on Power Architecture technology and is optimized for embedded communications and controller applications.

With a 66 MHz core, integrated communications co‑processor (CPM), DRAM controller and multiple Ethernet interfaces, the MPC860DTVR66D4 delivers a highly integrated solution for networking and embedded systems that require compact, standards‑oriented communications capability and reliable operation in consumer environments.

Key Features

  • Processor Core — MPC8xx 32‑bit core, single core operating at 66 MHz, implementing Power Architecture technology.
  • Integrated Communications CPM — Communications co‑processor (CPM) included to support communications tasks and offload the CPU.
  • Memory Support — On‑chip memory controller with DRAM support for flexible system memory configurations.
  • Ethernet Interfaces — Multiple Ethernet channels: two 10 Mbps ports and one 10/100 Mbps port for versatile network connectivity.
  • Serial Protocol Support — HDLC/SDLC protocol interfaces for standard synchronous data link layer communications.
  • I/O Voltage — 3.3 V I/O domain for compatibility with common embedded system logic levels.
  • Package & Mounting — 357‑ball PBGA package (357‑PBGA, 25×25) / 357‑BBGA; surface mount device for high‑density board designs.
  • Operating Range — Consumer qualification with operating temperature range of 0 °C to 95 °C.
  • RoHS Compliance — Device is RoHS compliant, supporting environmentally conscious designs.
  • Documentation & Family Support — Part of the MPC860 PowerQUICC family with comprehensive hardware specifications and user manuals available for system design and validation.

Typical Applications

  • Communications Equipment — Designed for embedded communications and networking systems that require integrated protocol processing and multiple Ethernet interfaces.
  • Embedded Controllers — Suited for general controller applications where an integrated CPM and DRAM support simplify system architecture.
  • Networked Devices — Useful in devices that need mixed 10 Mbps and 10/100 Mbps Ethernet connectivity with onboard protocol handling.

Unique Advantages

  • Integrated Communications Engine: The CPM reduces CPU load for communications tasks, simplifying software design and improving throughput for networked applications.
  • Flexible Memory Support: On‑chip DRAM controller enables a range of memory choices to match performance and cost targets.
  • Multiple Ethernet Ports: Built‑in Ethernet interfaces (two 10 Mbps, one 10/100 Mbps) provide multi‑port connectivity without additional PHYs for many topologies.
  • Compact, Surface‑Mount Package: 357‑ball PBGA/BBGA package supports high‑density PCB layouts for space‑conscious embedded designs.
  • Industry Documentation: Part of a well‑documented PowerQUICC family with hardware specifications and design guidance to accelerate development.
  • Regulatory and Environmental: RoHS compliance supports environmentally conscious product roadmaps.

Why Choose MPC860DTVR66D4?

The MPC860DTVR66D4 positions itself as a compact, communications‑focused microprocessor that combines a Power Architecture 32‑bit core with an integrated communications processor and DRAM controller. Its multi‑port Ethernet capability and support for HDLC/SDLC make it suitable for embedded systems that require robust protocol handling and network connectivity within a consumer qualification envelope.

This device is ideal for designers seeking an integrated solution that reduces board-level complexity and leverages the MPC860 PowerQUICC family documentation for design and validation. RoHS compliance and a standard 3.3 V I/O domain further simplify integration into modern embedded platforms.

Request a quote or submit an inquiry to receive pricing and availability for MPC860DTVR66D4 and begin planning your design integration.

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