MPC860DTVR66D4
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,798 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC860 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (2), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 66MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC860DTVR66D4 – IC MPU MPC8XX 66MHZ 357BGA
The MPC860DTVR66D4 is a single‑core 32‑bit microprocessor from NXP Semiconductors’ MPC860 PowerQUICC family. It implements the MPC8xx core built on Power Architecture technology and is optimized for embedded communications and controller applications.
With a 66 MHz core, integrated communications co‑processor (CPM), DRAM controller and multiple Ethernet interfaces, the MPC860DTVR66D4 delivers a highly integrated solution for networking and embedded systems that require compact, standards‑oriented communications capability and reliable operation in consumer environments.
Key Features
- Processor Core — MPC8xx 32‑bit core, single core operating at 66 MHz, implementing Power Architecture technology.
- Integrated Communications CPM — Communications co‑processor (CPM) included to support communications tasks and offload the CPU.
- Memory Support — On‑chip memory controller with DRAM support for flexible system memory configurations.
- Ethernet Interfaces — Multiple Ethernet channels: two 10 Mbps ports and one 10/100 Mbps port for versatile network connectivity.
- Serial Protocol Support — HDLC/SDLC protocol interfaces for standard synchronous data link layer communications.
- I/O Voltage — 3.3 V I/O domain for compatibility with common embedded system logic levels.
- Package & Mounting — 357‑ball PBGA package (357‑PBGA, 25×25) / 357‑BBGA; surface mount device for high‑density board designs.
- Operating Range — Consumer qualification with operating temperature range of 0 °C to 95 °C.
- RoHS Compliance — Device is RoHS compliant, supporting environmentally conscious designs.
- Documentation & Family Support — Part of the MPC860 PowerQUICC family with comprehensive hardware specifications and user manuals available for system design and validation.
Typical Applications
- Communications Equipment — Designed for embedded communications and networking systems that require integrated protocol processing and multiple Ethernet interfaces.
- Embedded Controllers — Suited for general controller applications where an integrated CPM and DRAM support simplify system architecture.
- Networked Devices — Useful in devices that need mixed 10 Mbps and 10/100 Mbps Ethernet connectivity with onboard protocol handling.
Unique Advantages
- Integrated Communications Engine: The CPM reduces CPU load for communications tasks, simplifying software design and improving throughput for networked applications.
- Flexible Memory Support: On‑chip DRAM controller enables a range of memory choices to match performance and cost targets.
- Multiple Ethernet Ports: Built‑in Ethernet interfaces (two 10 Mbps, one 10/100 Mbps) provide multi‑port connectivity without additional PHYs for many topologies.
- Compact, Surface‑Mount Package: 357‑ball PBGA/BBGA package supports high‑density PCB layouts for space‑conscious embedded designs.
- Industry Documentation: Part of a well‑documented PowerQUICC family with hardware specifications and design guidance to accelerate development.
- Regulatory and Environmental: RoHS compliance supports environmentally conscious product roadmaps.
Why Choose MPC860DTVR66D4?
The MPC860DTVR66D4 positions itself as a compact, communications‑focused microprocessor that combines a Power Architecture 32‑bit core with an integrated communications processor and DRAM controller. Its multi‑port Ethernet capability and support for HDLC/SDLC make it suitable for embedded systems that require robust protocol handling and network connectivity within a consumer qualification envelope.
This device is ideal for designers seeking an integrated solution that reduces board-level complexity and leverages the MPC860 PowerQUICC family documentation for design and validation. RoHS compliance and a standard 3.3 V I/O domain further simplify integration into modern embedded platforms.
Request a quote or submit an inquiry to receive pricing and availability for MPC860DTVR66D4 and begin planning your design integration.

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