MPC860ENCVR66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 1,446 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860ENCVR66D4 – IC MPU MPC8XX 66MHZ 357BGA

The MPC860ENCVR66D4 is a single‑core 32‑bit microprocessor in the MPC860 PowerQUICC family, designed for embedded communications and networking applications. It implements Power Architecture technology with integrated communications support and a memory controller, making it suitable for industrial embedded controllers and networked equipment.

Clocked at 66 MHz with 3.3 V I/O and industrial qualification, the device combines a 32‑bit CPU core with an enhanced communications processor module (CPM) and support for DRAM, I²C and multiple Ethernet channels for embedded communications tasks.

Key Features

  • CPU Core  32‑bit MPC8xx core built on Power Architecture technology; includes MMUs and instruction/data caches as described in the MPC860 family hardware specifications.
  • Performance  66 MHz operating frequency suitable for embedded control and communications processing tasks.
  • Communications Processor (CPM)  Integrated CPM for communications and protocol handling; includes an I²C channel as part of the CPM enhancements.
  • Memory Support  On‑chip memory controller capable of supporting DRAM types; supports system memory configurations for embedded platforms.
  • Ethernet  Ethernet capability listed as 10 Mbps (4), enabling multiple Ethernet interfaces for networked applications.
  • Package & Mounting  357‑pin PBGA package (25 × 25 mm) supplied in a 357‑BBGA package case; surface mount device.
  • Power & I/O  3.3 V I/O for standard embedded system logic levels.
  • Operating Range & Qualification  Industrial qualification with an operating temperature range of −40°C to 95°C.
  • Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Networked Embedded Controllers  Leverage the integrated CPM and multiple Ethernet interfaces to handle communications, protocol processing and network connectivity in embedded appliances.
  • Industrial Automation  Industrial‑rated temperature range and DRAM support make the device suitable for control, monitoring and I/O aggregation in industrial systems.
  • Communications Equipment  Designed for communications and networking system functions where on‑chip CPM and I²C support facilitate protocol handling and peripheral management.
  • PCMCIA‑enabled Designs  MPC860 family documentation notes built‑in support for PCMCIA socket controller functionality for designs requiring removable card interfaces.

Unique Advantages

  • Integrated Communications Offload:  On‑chip CPM reduces external controller requirements for communications and protocol tasks.
  • Power Architecture Core with MMU and Caches:  MMUs and instruction/data caches improve system determinism and software portability for embedded OS use.
  • Industrial Temperature Qualification:  Rated for −40°C to 95°C to meet the demands of industrial environments.
  • Compact PBGA Packaging:  357‑pin PBGA (25×25 mm) surface‑mount package supports dense board layouts while providing full connectivity.
  • Standard I/O and Memory Support:  3.3 V I/O, I²C channel, DRAM controller and multiple Ethernet interfaces enable straightforward integration with common embedded subsystems.
  • Regulatory and Manufacturing Compatibility:  RoHS compliance for modern manufacturing and supply chains.

Why Choose MPC860ENCVR66D4?

The MPC860ENCVR66D4 positions itself as a compact, industrially qualified communications microprocessor combining a Power Architecture 32‑bit core with an integrated communications processor, memory controller and standard interfaces. Its specification set—66 MHz clock, 3.3 V I/O, I²C, DRAM support, multiple Ethernet channels and wide operating temperature—addresses embedded designs that require integrated communications handling and robust operation in industrial environments.

This device is suited for designers building networked embedded systems, communications appliances and industrial controllers who need a documented hardware platform from the MPC860 family with on‑chip CPM functionality and standard peripheral interfaces.

Request a quote or submit a purchasing inquiry for the MPC860ENCVR66D4 to receive pricing, availability and ordering details.

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