MPC860DTCVR50D4

The MPC860DTCVR50D4 is a PowerQUICC family microprocessor IC from NXP Semiconductors, featuring a single 32‑bit core running at 50 MHz in a 357‑PBGA (25×25) package. It combines a Power Architecture™ CPU with an integrated communications processor module (CPM) and enhanced memory controller functionality.

Designed for embedded and industrial systems, this device targets communications and networking applications that require integrated serial and packet interfaces, flexible memory support, and extended temperature operation.

Key Features

• Core and Architecture  Single 32‑bit MPC8xx core at 50 MHz implementing Power Architecture™ technology for deterministic embedded processing.
• Communications Processor (CPM)  Integrated CPM for communications and protocol handling with support for HDLC/SDLC interfaces and communications co‑processor functionality.
• Memory and DRAM Controller  Enhanced memory controller with support for DRAM, enabling flexible memory configurations for embedded applications.
• Ethernet Connectivity  Integrated Ethernet support including two 10 Mbps ports and one 10/100 Mbps port to enable a range of network topologies and link speeds.
• Voltage and I/O  3.3 V I/O compatibility for standard embedded system interfacing.
• Package and Mounting  357‑PBGA supplier device package (25×25) in a surface‑mount form factor suitable for high‑density PCB assembly.
• Industrial Qualification and Temperature Range  Industrial qualification with an operating temperature from ‑40 °C to 95 °C for robust performance in demanding environments.
• Standards and Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Communications Equipment  Use as a one‑chip controller for protocol handling, serial link management, and interface aggregation in communications gear.
• Networking Appliances  Ideal for embedded networking devices that require multiple Ethernet ports and integrated CPM support for traffic processing.
• Industrial Control Systems  Suitable for industrial controllers and automation equipment that demand extended temperature operation and ruggedized components.
• Embedded Systems  Fits compact, surface‑mount designs requiring a balanced combination of CPU capability, integrated peripherals, and DRAM support.

Unique Advantages

• Highly integrated communications capability: Integrated CPM and HDLC/SDLC interfaces reduce external component count and simplify protocol implementations.
• Multi‑port Ethernet support: Two 10 Mbps ports plus one 10/100 Mbps port provide flexible connectivity options for networked designs.
• Industrial temperature range: Rated for ‑40 °C to 95 °C, enabling deployment in harsh or temperature‑sensitive environments.
• Flexible memory support: Enhanced DRAM controller allows designers to choose memory configurations that match performance and cost targets.
• Compact PBGA package: 357‑PBGA (25×25) surface‑mount package supports high‑density board layouts while maintaining necessary I/O.
• Regulatory readiness: RoHS compliance supports modern manufacturing and supply‑chain requirements.

Why Choose MPC860DTCVR50D4?

The MPC860DTCVR50D4 positions itself as a balanced, integrated microprocessor solution for embedded communications and industrial networking designs. Its Power Architecture™ 32‑bit core, combined with an integrated CPM and versatile memory controller, delivers a compact platform for protocol processing and system control.

With multi‑port Ethernet, extended operating temperature, and a compact PBGA footprint, this device suits engineers seeking a reliable, field‑ready MPU backed by NXP/Freescale product documentation and hardware specifications for design and validation.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the MPC860DTCVR50D4.