MPC860DEZQ80D4

IC MPU MPC8XX 80MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)

Quantity 461 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed80MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860DEZQ80D4 – IC MPU MPC8XX 80MHz 357-PBGA

The MPC860DEZQ80D4 is a single‑core, 32‑bit microprocessor in the MPC860 PowerQUICC family, delivering an 80 MHz core built on Power Architecture technology. It integrates a communications processor module (CPM), memory controller and on‑chip system features to address embedded controller and communications applications.

Designed for embedded and networking‑oriented controller applications, the device targets systems that require on‑chip communications support, DRAM interfacing and peripheral integration while operating from 3.3 V I/O and within a 0 °C to 95 °C temperature window. The device is RoHS compliant.

Key Features

  • Core & Architecture  32‑bit MPC8xx core at 80 MHz with Power Architecture technology; includes memory management units (MMUs) and instruction and data caches as described in the MPC860 family documentation.
  • Communications Processor (CPM)  Integrated CPM for communications offload and control; supports communications‑focused functions highlighted in the MPC860 family hardware specifications.
  • Memory & Controllers  On‑chip memory controller supporting DRAM, enabling direct interfacing with common dynamic memory types.
  • Interfaces  Includes multiple communications interfaces such as I2C and two 10 Mbps Ethernet ports as listed in the product specifications.
  • Power & I/O  3.3 V I/O voltage for standard embedded system compatibility.
  • Package & Mounting  357‑PBGA (25x25) surface‑mount package (357‑BBGA package case referenced in product data) for compact board integration.
  • Operating Range & Compliance  Operating temperature range from 0 °C to 95 °C and RoHS compliant.

Typical Applications

  • Embedded Communications Controllers  Use the integrated CPM and Ethernet interfaces for packet handling and protocol control in communications equipment.
  • Networked Control Systems  Single‑chip integration of CPU, DRAM controller and interfaces simplifies design of networked controllers and gateways.
  • General Embedded Systems  Suitable for embedded controller applications that require a 32‑bit core with MMUs and on‑chip caches for system software support.

Unique Advantages

  • Integrated Communications Subsystem  The on‑chip CPM provides dedicated communications processing capability, reducing external component requirements for networking functions.
  • On‑Chip Memory Management  MMUs plus instruction and data caches support system software and memory protection schemes referenced in the family documentation.
  • Direct DRAM Support  Built‑in DRAM controller enables straightforward connection to dynamic memory, simplifying memory subsystem design.
  • Multiple Embedded Interfaces  I2C plus dual 10 Mbps Ethernet ports provide the I/O needed for networking and peripheral control without adding interface adapters.
  • Industry‑Ready Packaging  357‑PBGA surface‑mount package supports compact PCB layouts for space‑constrained designs.
  • RoHS Compliance  RoHS status is compliant, supporting environmental and regulatory requirements.

Why Choose MPC860DEZQ80D4?

The MPC860DEZQ80D4 positions itself as a compact, integrated microprocessor solution for embedded communications and controller designs that need an on‑chip communications processor, DRAM interface and standard embedded I/O. With a 32‑bit MPC8xx core at 80 MHz, MMUs, caches and dedicated CPM functionality, it provides a practical balance of processing and communications integration for systems engineers.

This device is suited to designs prioritizing integration and a defined operating range (0 °C to 95 °C), 3.3 V I/O compatibility and a surface‑mount 357‑PBGA package. Its RoHS compliance and the documentation available for the MPC860 family support product lifecycle and regulatory considerations.

Request a quote or submit an inquiry to get pricing and availability for MPC860DEZQ80D4 and discuss how this device can be integrated into your next embedded communications or control design.

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