MPC860DEVR80D4

IC MPU MPC8XX 80MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)

Quantity 370 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC860
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed80MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC860DEVR80D4 – IC MPU MPC8XX 80MHz 357BGA

The MPC860DEVR80D4 is a single‑core 32‑bit microprocessor from the MPC860 PowerQUICC family by NXP Semiconductors. It implements a 32‑bit Power Architecture™ core with integrated communications peripherals and a communications processor module (CPM), making it suitable for embedded controller and communications applications.

Designed for controller and networking systems, the device integrates memory control, CPM communications co‑processing, dual Ethernet ports, and I/O support in a compact 357‑PBGA (25×25) surface‑mount package, offering a balanced combination of integration and moderate clock performance at 80 MHz.

Key Features

  • Core & Architecture 32‑bit MPC8xx core running at 80 MHz with on‑chip instruction and data cache and memory management support as documented for the MPC860 family.
  • Communications Processor Module (CPM) Integrated CPM optimized for communications tasks; includes additional communications interfaces such as an I2C channel.
  • Ethernet Two 10 Mbps Ethernet interfaces for network connectivity and embedded communications tasks.
  • Memory & Storage Enhanced memory controller with DRAM support and integrated PCMCIA socket controller capability as provided in the MPC860 family specification.
  • Power & I/O 3.3 V I/O voltage and surface‑mount 357‑PBGA (25×25) package for standard board integration.
  • Temperature & Qualification Consumer‑grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance for regulatory alignment.

Typical Applications

  • Communications and Networking Systems — Embedded network controllers and communications equipment that leverage the integrated CPM and dual Ethernet interfaces.
  • Embedded Controller Applications — General embedded controllers requiring a 32‑bit core with MMU and caches for task management and system control.
  • Expandable/Modular Designs — Systems that benefit from on‑chip PCMCIA socket controller capability and DRAM support for modular memory or interface expansion.

Unique Advantages

  • Integrated Communications Subsystem — On‑chip CPM and I2C support consolidate communications functions and reduce external component count.
  • Dual Ethernet Interfaces — Two 10 Mbps Ethernet ports enable straightforward networking connectivity without additional PHY controllers.
  • Memory Flexibility — Enhanced memory controller with DRAM support accommodates a range of memory choices for system designers.
  • Compact, Surface‑Mount Package — 357‑PBGA (25×25) package enables high‑density PCB layouts for space‑constrained applications.
  • Established Architecture and Documentation — Part of the MPC860 PowerQUICC family with available hardware specifications and datasheet material for design reference.
  • RoHS Compliant — Meets RoHS environmental requirements for lead‑free assemblies.

Why Choose MPC860DEVR80D4?

The MPC860DEVR80D4 combines a 32‑bit Power Architecture core, integrated communications co‑processing, and memory controller functionality in a single package, delivering an integrated platform for embedded communications and controller designs. Its dual Ethernet interfaces, I2C support, and DRAM compatibility make it appropriate for systems that require on‑board communications and flexible memory options.

Backed by NXP Semiconductors' MPC860 family documentation and hardware specifications, this device is suited for designers seeking a documented, integrated microprocessor solution for consumer‑grade embedded and networking applications that operate within the 0 °C to 95 °C range.

Request a quote or submit an inquiry to get pricing and availability for the MPC860DEVR80D4.

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