MPC860DECVR50D4

The MPC860DECVR50D4 is a single-core, 32-bit MPC8xx microprocessor IC running at 50 MHz, designed as an integrated microprocessor and peripheral combination for embedded applications. Built on Power Architecture technology, the device targets communications and networking systems and industrial embedded controllers that benefit from integrated communications subsystems and memory support.

This device integrates a communications processor module (CPM), DRAM memory controller and dual 10 Mbps Ethernet interfaces, and operates from 3.3 V I/O with a specified industrial temperature range of −40 °C to 95 °C. The device is supplied in a 357-PBGA (25×25) surface-mount package and is RoHS compliant.

Key Features

• Core and Architecture  Single MPC8xx 32-bit core at 50 MHz, implementing Power Architecture technology.
• Communications Co-processor (CPM)  Integrated communications co-processor (CPM) to support communications-oriented tasks and peripheral control.
• Ethernet  Two 10 Mbps Ethernet interfaces for network connectivity in communications and networking applications.
• Memory Support  Integrated DRAM controller enabling support for external DRAM memories.
• I/O and Voltage  3.3 V I/O signaling for compatibility with common embedded system voltage domains.
• Package and Mounting  357-PBGA (25×25) package, surface-mount mounting type.
• Industrial Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 95 °C.
• Interfaces  Additional on-chip interface: I2C for peripheral communications.
• Compliance  RoHS compliant.

Typical Applications

• Communications and Networking Systems  On-chip CPM and dual Ethernet interfaces make the MPC860 suitable for embedded networking equipment and communications controllers.
• Industrial Embedded Control  Industrial-grade temperature range and integrated peripherals suit automation and control applications that require reliable operation in harsh environments.
• Memory-Dependent Embedded Designs  Integrated DRAM controller supports designs that require external DRAM for buffering, code storage, or data processing.
• Peripheral Interface Platforms  I2C and CPM connectivity enable integration with a variety of sensors, UARTs, and peripheral modules in embedded systems.

Unique Advantages

• Integrated Communications Subsystems: On-chip CPM and Ethernet interfaces reduce the need for separate communications controllers.
• Embedded Memory Support: Built-in DRAM controller simplifies system memory design for higher-performance embedded applications.
• Industrial Temperature Range: Rated from −40 °C to 95 °C to meet the demands of industrial and harsh-environment deployments.
• Standard 3.3 V I/O: 3.3 V signaling ensures compatibility with common embedded voltage domains and peripherals.
• Compact Surface-Mount Package: 357-PBGA (25×25) package supports dense board layouts while providing the necessary I/O and thermal characteristics for embedded designs.
• Regulatory Compliance: RoHS compliant to support environmental and manufacturing requirements.

Why Choose MPC860DECVR50D4?

The MPC860DECVR50D4 delivers a balanced combination of a Power Architecture 32-bit core, integrated communications processing, and memory interface capabilities in a single-chip solution. Its industrial temperature rating and RoHS compliance make it well suited for embedded communication and control systems that require dependable operation across challenging environments.

This part is ideal for engineers designing embedded networking, communications controllers, and industrial systems that need integrated Ethernet, CPM-based communications handling, and external DRAM support while maintaining a compact surface-mount footprint.

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