MPC859TZP133A

The MPC859TZP133A is a single‑core, 32‑bit MPC8xx microprocessor operating at 133 MHz, combining a PowerPC™‑derivative core with integrated communications and peripheral functions. It is designed for embedded controller and communications/networking applications where integration of Ethernet, serial protocols and memory interfaces reduces system complexity.

Built on the MPC866/859 family architecture, the MPC859T variant provides on‑chip communications support (CPM) and DRAM controller functionality while maintaining RoHS compliance and standard surface‑mount PBGA packaging for compact system integration.

Key Features

• Core – Embedded single‑issue, 32‑bit PowerPC architecture with thirty‑two 32‑bit general‑purpose registers and branch prediction.
• Performance – 133 MHz core frequency suitable for control and communications tasks in embedded systems.
• Cache and MMU – Family feature set includes configurable instruction and data caches and MMUs with fully associative TLBs; the MPC859T is specified within this feature set.
• Communications Co‑processor (CPM) – Integrated communications processing support for protocol offload and serial channel handling.
• Ethernet Interfaces – Integrated Ethernet support with one 10 Mbps interface and one 10/100 Mbps interface for networking connectivity.
• Memory and Controllers – On‑chip DRAM controller for system memory interfacing.
• Serial Protocols – Additional HDLC/SDLC interface support for serial communications.
• Power and I/O – 3.3 V I/O voltage compatibility for standard embedded system interfaces.
• Package and Mounting – 357‑PBGA (25x25) surface‑mount package (357‑BBGA case), enabling compact board layouts.
• Operating Range – Specified operating temperature from 0 °C to 95 °C.
• Environmental – RoHS compliant.

Typical Applications

• Communications Equipment – Use as a control and protocol processor in networking and communications systems leveraging integrated Ethernet and CPM features.
• Embedded Controllers – Core and peripheral integration make the MPC859TZP133A suited for embedded control applications requiring serial protocol handling and DRAM interfacing.
• Networking Appliances – On‑chip 10/100 Mbps and 10 Mbps Ethernet support facilitates use in compact networking devices and gateways.
• Industrial Controllers – Surface‑mount PBGA packaging and a 0 °C to 95 °C operating range support deployment in many industrial embedded systems.

Unique Advantages

• Integrated Communications Subsystem: The CPM and HDLC/SDLC interfaces reduce external components required for serial and protocol handling.
• Dual Ethernet Capability: Having both 10 Mbps and 10/100 Mbps Ethernet interfaces on‑chip simplifies network connectivity design and lowers BOM.
• Compact PBGA Package: 357‑PBGA (25x25) surface‑mount package enables dense board layouts while retaining necessary I/O and memory interfaces.
• Design‑Ready Voltage: 3.3 V I/O compatibility aligns with common embedded platform voltage standards for straightforward system integration.
• Wide Operating Range: Specified 0 °C to 95 °C operating temperature allows use across a broad set of embedded and industrial environments.
• RoHS Compliance: Environmentally compliant manufacturing reduces regulatory risk for product deployments.

Why Choose MPC859TZP133A?

The MPC859TZP133A positions itself as a highly integrated microprocessor option within the MPC866/859 family for embedded and communications applications. With a PowerPC‑based 32‑bit core at 133 MHz, integrated CPM, DRAM controller and dual Ethernet interfaces, it addresses common design goals of reducing external components and simplifying board-level design.

This part is suitable for engineers designing embedded controllers, networking appliances and communications equipment that require verified family‑level features—such as cache/MMU support and protocol offload—combined with a compact 357‑PBGA footprint and RoHS compliance.

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