MPC857TZQ100B

IC MPU MPC8XX 100MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 357-PBGA (25x25)

Quantity 1,150 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC857
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed100MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC857TZQ100B – IC MPU MPC8XX 100MHz 357BGA

The MPC857TZQ100B is a single‑core, 32‑bit microprocessor in the MPC8xx family designed for embedded controller and communications applications. It implements an embedded MPC8xx PowerPC‑architecture core running at 100 MHz and integrates communications and peripheral functionality to simplify system design.

Targeted at embedded and networking systems, the device combines processor performance, on‑chip communications support and standard peripheral interfaces to address controller, communications and networking use cases where integration and robust I/O are important.

Key Features

  • Core Embedded single‑issue, 32‑bit MPC8xx core implementing the PowerPC architecture, providing a familiar architecture for embedded and networking firmware.
  • Operating Speed 100 MHz core clock for deterministic processing in controller and communications tasks.
  • Memory and MMU Includes MMU functionality with a 32‑entry TLB; family documentation describes cache coherency and cache lock capabilities for efficient memory management.
  • Communications Offload On‑chip Communications Processor Module (CPM) and communications co‑processor support to offload serial and packet processing tasks.
  • Ethernet Integrated Ethernet capability with one 10 Mbps interface and one 10/100 Mbps interface for network connectivity.
  • Peripheral Interfaces Supports HDLC/SDLC interfaces and DRAM controller integration for common embedded communications and buffering needs.
  • Power and I/O 3.3 V I/O voltage for compatibility with standard embedded peripherals.
  • Package and Mounting 357‑ball PBGA package (357‑PBGA, 25×25) in a surface‑mount form factor suited for compact board designs.
  • Temperature Range Rated for operation from 0 °C to 105 °C to cover a broad set of commercial and industrial ambient conditions.
  • Environmental Compliance RoHS compliant.
  • Qualification Consumer‑qualified device from the MPC857 family.

Typical Applications

  • Communications Equipment Use the integrated Ethernet interfaces and CPM to implement network controllers, edge devices and protocol handling functions.
  • Embedded Networked Controllers Suitable for embedded controllers that require deterministic 32‑bit processing alongside serial and packet I/O.
  • Industrial Networking Applies to industrial communications modules and networked controllers where integrated DRAM control and HDLC/SDLC support simplify BOM and design.

Unique Advantages

  • Integrated Communications Processing The on‑chip CPM and communications co‑processor support reduce external components and offload packet/serial processing from the main CPU.
  • Dual Ethernet Interfaces Provision of both a 10 Mbps and a 10/100 Mbps Ethernet interface enables flexible network connectivity options without additional PHYs.
  • Compact PBGA Packaging 357‑PBGA (25×25) surface‑mount package enables high‑density board designs while delivering abundant I/O.
  • Embedded MMU and Cache Features Family MMU and cache capabilities support efficient memory management and coherency for multi‑tasking embedded firmware.
  • Broad Operating Range 0 °C to 105 °C rating supports deployment across a wide range of commercial and industrial environments.
  • Standards‑friendly I/O Voltage 3.3 V I/O compatibility simplifies interfacing with common peripheral devices.

Why Choose MPC857TZQ100B?

The MPC857TZQ100B positions itself as an integrated solution for embedded and communications designs that need a compact, single‑core PowerPC‑architecture processor with built‑in communications support. Its combination of a 100 MHz MPC8xx core, Communications Processor Module, dedicated Ethernet interfaces and DRAM controller reduces external components and streamlines system architecture.

This device is suited to engineers building networked controllers, communications modules or embedded systems where integration, predictable performance and a surface‑mount PBGA package are priorities. Its RoHS compliance and extended operating temperature range provide practical long‑term value for commercial and industrial deployments.

Request a quote or submit an inquiry to get pricing and availability for the MPC857TZQ100B.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up