MPC857TCVR66B

The MPC857TCVR66B is an NXP Semiconductors microprocessor from the MPC857 family featuring a single embedded MPC8xx PowerPC‑architecture core. It delivers a 66 MHz operating frequency and integrated communications functionality, making it suitable for embedded controller and networking applications.

Designed for industrial environments, the device combines on‑chip communications processing, DRAM controller support and Ethernet interfaces with a compact 357‑PBGA (25×25) surface‑mount package for space‑constrained designs.

Key Features

• Core and Performance  Single MPC8xx embedded 32‑bit core running at 66 MHz, implementing PowerPC architecture elements for deterministic embedded processing.
• Communications Processing (CPM)  Integrated communications co‑processor functionality (CPM) to support communications and protocol offload tasks.
• Memory Support  On‑chip DRAM controller support for system memory interfacing to simplify board design.
• Ethernet Interfaces  Dual Ethernet capability: one 10 Mbps interface and one 10/100 Mbps interface for mixed‑speed network connectivity.
• Serial Protocol Support  Additional interfaces include HDLC/SDLC support for protocol framing and serial link management.
• Supply and I/O  3.3 V I/O operating level for compatibility with common embedded peripherals and board ecosystems.
• Package and Mounting  357‑ball PBGA (25×25) surface‑mount package offering a compact footprint for space‑limited boards.
• Industrial Temperature Range  Qualified for industrial use with an operating temperature range of −40 °C to 115 °C.
• RoHS Compliant  Lead‑free, RoHS‑compliant device suitable for modern manufacturing requirements.

Typical Applications

• Embedded Communications Equipment  Use the integrated CPM and Ethernet interfaces to implement protocol handling and packet I/O in routers, gateways and protocol converters.
• Industrial Control Systems  Leverage the industrial temperature rating and DRAM controller support for machine control, PLCs and process automation controllers.
• Networked Telemetry and Monitoring  Combine serial HDLC/SDLC links and Ethernet ports for remote telemetry units and distributed monitoring nodes.
• Compact Embedded Controllers  The 357‑PBGA package enables compact board designs where integrated communications and deterministic control are required.

Unique Advantages

• Integrated Communications Subsystem: On‑chip CPM and HDLC/SDLC interfaces reduce external logic and simplify implementation of communication protocols.
• Dual Ethernet Flexibility: One 10 Mbps and one 10/100 Mbps Ethernet interface enable mixed‑speed network connectivity without added PHY complexity.
• Industrial‑Grade Operation: −40 °C to 115 °C operating range supports deployment in harsh industrial environments.
• Compact PBGA Package: 357‑ball, 25×25 PBGA minimizes PCB area while providing the I/O density needed for embedded systems.
• 3.3 V I/O Standardization: 3.3 V signaling matches common peripheral voltage domains, easing system integration.
• RoHS Compliance: Meets RoHS requirements for lead‑free manufacturing processes.

Why Choose MPC857TCVR66B?

The MPC857TCVR66B is positioned for designers who need an integrated, industrial‑qualified embedded processor with dedicated communications capabilities. Its MPC8xx PowerPC core, on‑chip CPM, serial protocol support and dual Ethernet interfaces provide a focused set of features for networking and control applications while keeping board complexity and component count low.

This device is well suited for long‑lifecycle industrial and communications products where temperature tolerance, Ethernet connectivity and deterministic embedded processing are required. Its compact PBGA package and 3.3 V I/O facilitate integration into space‑constrained designs and common board ecosystems.

Request a quote or submit an inquiry to obtain pricing and availability for the MPC857TCVR66B and to discuss suitability for your specific embedded or communications application.