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Total Products: 3,238
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
BSC9132NSE7MNMBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
1,074
N/A
BSC9132NSN7KNKBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850 – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
354
N/A
BSC9132NSN7MNMBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850 – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
1,773
N/A
BSC9132NXE7KNKBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
507
N/A
BSC9132NXE7MNMBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
69
N/A
BSC9132NXN7KNKBNXP SemiconductorsBSC9132 - QORIQ QONVERGE SOC, 2XMicroprocessorsN/AN/AN/A

N/A

1,295
N/A
BSC9132NXN7MNMBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850 – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
Additional Interfaces:
AIC, DUART, I2C, MMC/SD, SPI, USIM
318
N/A
FS32V232BMN1VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A53, Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
GbE
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
649
N/A
FS32V232BMN2VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
435
N/A
FS32V232CKN1VUBNXP SemiconductorsISP CSE 1GHZ DUAL COREMicroprocessorsN/AN/AN/A

N/A

154
N/A
FS32V232CKN1VUBRNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
1,845
N/A
FS32V232CKN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
773
N/A
FS32V232CKN2VUBRNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
136
N/A
FS32V232CTN1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
1,662
N/A
FS32V232CTN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
778
FS32V234BJN1VUB
FS32V234BJN1VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
1Gbps
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
66
N/A
FS32V234BJN2VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
749
FS32V234BLN1VUB
FS32V234BLN1VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
1Gbps
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
378
N/A
FS32V234BLN2VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
893
FS32V234BMN1VUB
FS32V234BMN1VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
1Gbps
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
382

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