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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMIMX9301CVVXDABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 105 °C
Speed:
900 MHz
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
RAM Controllers:
LPDDR4, LPDDR4X
Graphics Acceleration:
Yes
Display & Interface Controllers:
24-bit Parallel, 4-Lane LVDS, MIPI-DSI-4
Qualification:
Industrial
57
N/AMIMX9302CVVXDABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 105 °C
Speed:
900 MHz
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4, LPDDR4X
Graphics Acceleration:
Yes
Display & Interface Controllers:
24-bit Parallel, 4-Lane LVDS, MIPI-DSI-4
Qualification:
Industrial
1,068
N/AN/AMIMX9311CVXXMABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 105 °C
Speed:
1.7 GHz
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
RAM Controllers:
LPDDR4, LPDDR4X
Graphics Acceleration:
Yes
Display & Interface Controllers:
24-bit Parallel
Qualification:
Industrial
1,495
N/AMIMX9331AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
960
N/AMIMX9331CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
522
N/AMIMX9331CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
766
N/AMIMX9331XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
176
N/AMIMX9332AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
1,643
N/AMIMX9332CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
546
N/AMIMX9332CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
1,030
N/AMIMX9332XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
354
N/AMIMX9351AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
71
N/AMIMX9351CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
895
N/AMIMX9351CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
1,306
N/AMIMX9351XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
453
N/AMIMX9352AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
745
N/AMIMX9352CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
338
N/AMIMX9352CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
898
N/AMIMX9352XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
1,753
N/AMIMXRT1181CVP2BNXP SemiconductorsICMicroprocessors144-MAPBGA (10x10)N/A-40 °C – 105 °C
Speed:
300 MHz
Core Processor:
ARM® Cortex®-M33
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
LPDDR4
Ethernet:
1Gbps (3)
Graphics Acceleration:
No
Qualification:
Industrial
336

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