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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMIMX9301CVVXDABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

947
N/AMIMX9302CVVXDABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

41
N/AN/AMIMX9311CVXXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

588
N/AMIMX9331AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,474
N/AMIMX9331CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
418
N/AMIMX9331CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

60
N/AMIMX9331XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
1,723
N/AMIMX9332AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,246
N/AMIMX9332CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
507
N/AMIMX9332CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

431
N/AMIMX9332XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
776
N/AMIMX9351AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

676
N/AMIMX9351CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
713
N/AMIMX9351CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

426
N/AMIMX9351XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
389
N/AMIMX9352AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

121
N/AMIMX9352CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
1,372
N/AMIMX9352CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,240
N/AMIMX9352XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
263
N/AMIMXRT1181CVP2BNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

382

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